Thermally conductive composites and method of preparing same

1. A method of preparing a thermally conductive composite comprising:

a) mixing 15% to 60% by weight of a polymer matrix with 10% to 85% by weight of a high-aspect-ratio thermally conductive filler having an aspect ratio of at least 5:1; and

(b) mixing a polymer melt obtained from step (a) with 10% to 85% by weight of a low-aspect-ratio thermally conductive filler having an aspect ratio of 2:1 or less.

2. The method of claim 1 , wherein the high-aspect-ratio thermally conductive filler has an aspect ratio in the range of 5:1 to 8:1.

3. The method of claim 1 , wherein the low-aspect-ratio thermally conductive filler has an aspect ratio of 1:1.

4. The method of claim 1 , wherein the polymer matrix comprises at least one selected from the group consisting of polyethylene (PE), high-density polyethylene (HDPE), polypropylene (PP), acrylonitrile butadiene styrene (ABS), polyamides (PA), polylactide (PLA), polycarbonate (PC), polyphenylene sulfide (PPS), polystyrene (PS), epoxies, silicones, polyurethanes, polyimides, and combinations thereof.

5. The method of claim 4 , wherein the polymer matrix comprises at least one selected from the group consisting of high-density polyethylene (HDPE), polypropylene (PP) and polyamides (PA).

6. The method of claim 4 , wherein the polymer matrix is a mixture of polypropylene (PP) and polyamides (PA), each at a weight ratio in the range of 10%-90%.

7. The method of claim 4 , wherein the polymer matrix is a mixture of high-density polyethylene (HDPE) and polyamides (PA), each at a weight ratio in the range of 10%-90%.

8. The method of claim 1 , wherein the high-aspect-ratio thermally-conductive filler has a flake shape.

9. The method of claim 1 , wherein the high-aspect-ratio thermally-conductive filler comprises at least one selected from the group consisting of boron nitride flakes, graphite flakes, expandable graphite, carbon fiber, graphene, molybdenum disulphide (MoS 2 ) whisker, magnesium oxide whisker, aluminium oxide whisker, calcium sulfate whisker, silicon carbide whisker, metal fibers, metal flakes, and combinations thereof.

10. The method of claim 9 , wherein the high-aspect-ratio thermally-conductive filler comprises graphite flakes.

11. The method of claim 1 , wherein the low-aspect-ratio thermally-conductive filler has a spherical, almost spherical or irregular shape.

12. The method of claim 1 , wherein the low-aspect-ratio thermally-conductive filler comprises at least one selected from the group consisting of silicon carbide particle, graphite particle, boron nitride (BN) particle, aluminium nitride (AlN) particle, silicon nitride (Si 3 N 4 ) particle, alumina particle, magnesium oxide particle, calcium sulfate particle, silicon carbide (SiC) particle, metal particles, and combinations thereof.

13. The method of claim 12 , wherein the low-aspect-ratio thermally-conductive filler comprises silicon carbide particle.

14. The method of claim 1 further comprising adding flame retardants, antioxidants, lubricants, dyes, and/or plasticizers.

15. The method of claim 1 further comprising pre-treating the fillers with a silane coupling agent.

16. The method of claim 15 , wherein the silane coupling agent comprises at least one selected from the group consisting of (3-aminopropyl) triethoxysilane, (3-glycidyloxypropyl) trimethoxysilane and 3-(trimethoxysilyl) propyl methacrylate.

17. A thermally conductive composite having thermal conductivity anisotropy in the range from 1 to 4, comprising:

15% to 60% by weight of a polymer matrix;

10% to 85% by weight of a high-aspect-ratio thermally conductive filler having an aspect ratio of at least 5:1; and

10% to 85% by weight of a low-aspect-ratio thermally conductive filler having an aspect ratio of 2:1 or less; wherein:

the polymer matrix comprises at least one selected from the group consisting of polyethylene (PE), high-density polyethylene (HDPE), polypropylene (PP), acrylonitrile butadiene styrene (ABS), polyamides (PA), polylactide (PLA), polycarbonate (PC), polyphenylene sulfide (PPS), polystyrene (PS), epoxies, silicones, polyurethanes, and polyimides;

the high-aspect-ratio thermally-conductive filler comprises at least one selected from the group consisting of boron nitride flakes, graphite flakes, expandable graphite, carbon fiber, graphene, molybdenum disulphide (MoS 2 ) whisker, magnesium oxide whisker, aluminium oxide whisker, calcium sulfate whisker, silicon carbide whisker, metal fibers, metal flakes, or combinations thereof; and

the low-aspect-ratio thermally-conductive filler comprises at least one selected from the group consisting of silicon carbide particle, graphite particle, boron nitride (BN) particle, aluminium nitride (AlN) particle, silicon nitride (Si 3 N 4 ) particle, alumina particle, magnesium oxide particle, calcium sulfate particle, silicon carbide (SiC) particle and metal particles.

18. The thermally conductive composite of claim 17 , wherein the high-aspect-ratio thermally conductive filler has an aspect ratio in the range of 5:1 to 8:1.

19. The thermally conductive composite of claim 17 , wherein the low-aspect-ratio thermally conductive filler has an aspect ratio of 1:1.

20. The thermally conductive composite of claim 17 , wherein the high-aspect-ratio thermally-conductive filler has a flake shape and the low-aspect-ratio thermally-conductive filler has a spherical, almost spherical or irregular shape.