Method of manufacturing a light emitting device

1. A method for fabricating a light emitting device, comprising:

forming a plurality of light emitting stacked layers above a substrate;

forming and patterning a current blocking (CB) layer on the light emitting stacked layers;

forming a transparent conductive layer covering the light emitting stacked layers and the current blocking layer;

etching the transparent conductive layer and exposing a reserved region for a first pad electrode and a mesa structure, respectively; and

etching an exposed portion of the light emitting stacked layers and a portion of the current blocking layer to form a remaining current blocking layer, the mesa structure and a first opening.

2. The method for fabricating the light emitting device as claimed in claim 1 , further comprising:

forming the first pad electrode by filling the first opening, and forming a second pad electrode on the mesa structure; and

depositing a passivation layer over a top surface of the light emitting device.

3. The method for fabricating the light emitting device as claimed in claim 2 , wherein the passivation layer is made of silicon nitride, silicon oxide, silicon oxynitride, or aluminum oxide, deposited on a defined surface area of the light emitting device using CVD, PECVD, ECR-CVD, or LPCVD.

4. The method for fabricating the light emitting device as claimed in claim 2 , wherein the first pad electrode comprises a p-pad electrode contacting a p-type layer of the light emitting stacked layers, and forming the first opening through the current blocking layer and the transparent conductive layer beneath the p-pad electrode.

5. The method for fabricating the light emitting device as claimed in claim 1 , wherein the exposed portion of the light emitting stacked layers and the portion of the current blocking layer are etched by dry etching.

6. The method for fabricating the light emitting device as claimed in claim 5 , wherein the current blocking layer is used as a hard mask upon dry-etching a portion of the light emitting stacked layers to form the mesa structure, while at substantially the same time, removing a portion of the current blocking layer, and upon completion of forming the mesa structure.

7. The method for fabricating the light emitting device as claimed in claim 6 , further comprising removing the remaining current blocking layer by a wet etching.

8. The method for fabricating the light emitting device as claimed in claim 7 , wherein the first pad electrode is formed by filling the first opening, wherein the mesa structure comprises a second opening and a second pad electrode is formed in the second opening of the mesa structure.

9. The method for fabricating the light emitting device as claimed in claim 1 , wherein a ratio of thickness of the current blocking layer to a depth of the mesa structure is between 1.3˜3.3.

10. The method for fabricating the light emitting device as claimed in claim 1 , wherein the mesa structure are formed using a same photoresist mask via a self-alignment process during photolithography, thereby producing sidewalls of the transparent conductive layer and of the mesa structure to be substantially flush to one another.

11. The method for fabricating the light emitting device as claimed in claim 10 , wherein a retract distance of the transparent conductive layer with respect to an edge of the mesa structure is less than 3 μm.

12. The method for fabricating the light emitting device as claimed in claim 10 , wherein a retract distance of the transparent conductive layer with respect to an edge of a sidewall of the current blocking layer is less than 3 μm.

13. The method for fabricating the light emitting device as claimed in claim 1 , wherein the light emitting stacked layers comprise p-type layers, n-type layers, and an active layer sandwiched between one of the p-type layers and one of the n-type layers, and the mesa structure comprises an exposed surface of one of the n-type layers.