IP Library Granted Patent US 9,904,170
Granted Patent B2
US 9,904,170 · App. 15/628,098 · Granted Feb 27, 2018

Reticle transmittance measurement method, projection exposure method using the same, and projection exposure device

Inventors: Michihiro Murata (Chiba, JP); Yutaka Gomi (Chiba, JP)
Assignee: SII Semiconductor Corporation
G03F7/20G01M11/0285G01N21/956G03F7/70666G03F7/70941G01N2021/5919G01N2021/95676
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Quick Facts
Patent No.
US 9,904,170
App. No.
15/628,098
Granted
Feb 27, 2018
Kind
B2
Abstract

When a reticle is first used, the reticle is loaded in a projection exposure device and measured by either oblique measurement or random measurement, thereby avoiding the fear of uneven sampling and determining the reticle transmittance of the entire reticle as the parent population, without increasing the sampling count. The same effect can be obtained by making the measurement spot size, which is fixed in general, variable and by changing the angle of incidence in relation to the measurement spot size.

Claims (7)

1. A reticle transmittance measurement method for a projection exposure device configured to project a pattern of a reticle onto a wafer to obtain a given pattern on the wafer,

the reticle transmittance measurement method comprising:

determining sampling pitches in an X-direction and a Y-direction to have a random value within a predetermined range instead of having a fixed value, to thereby set the sampling pitches so as to match with a different pattern of a reticle pattern that has a same repetition pitch, and not to match with a same pattern of the reticle pattern that has the same repetition pitch.

2. A projection exposure method, comprising performing exposure load correction based on a reticle transmittance that is determined by the reticle transmittance measurement method of claim 1 .

3. A projection exposure method according to claim 2 , wherein the exposure load correction comprises at least one of focus correction, lens distortion correction, or magnification correct.

4. A projection exposure device configured to measure a reticle transmittance using sampling and to project a pattern of a reticle onto a wafer to obtain a given pattern on the wafer,

wherein, in the sampling, sampling pitches in an X-direction and a Y-direction have a random value within a predetermined range instead of having a fixed value, to thereby set the sampling pitches so as not to match with a reticle pattern that has a repetition pitch but to have a reticle pattern that has different pitches.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
Priority Claims (2)
JP 2014-202016 · Sep 30, 2014 · national
JP 2015-053800 · Mar 17, 2015 · national
Continuity (2)
Division 14859781 · Sep 21, 2015
Related Publication 20170351180A1 · Dec 7, 2017