Thermocompression bonding with raised feature
View Patent ↗A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.
1. A bond between a first substrate and a second substrate, comprising:
a first metal layer on the first substrate;
a raised feature on the second substrate having a peak, wherein the raised feature encircles a device; and
a second metal layer over the second substrate and the raised feature, wherein adhesive bonding strength is due to a thermocompression bond between the first metal layer and the second metal layer in a vicinity of the raised feature, wherein the peak of the raised feature has a radius of curvature in its lateral cross sectional profile of less than about 5 microns, and the peak is embedded in the bond.
2. The bond of claim 1 , wherein the second substrate and the raised feature are both silicon.
3. The bond of claim 1 , wherein the first metal layer and the second metal layer are both gold, with a thickness of about 0.5 to 6 microns.
4. The bond of claim 1 , wherein the raised feature has a radius of curvature in its lateral cross sectional profile of less than about 3 microns.
5. The bond of claim 1 , wherein the first substrate and the second substrate comprise at least one of glass, metal, semiconductor or ceramic.
6. The bond of claim 1 , wherein the raised feature is completely embedded in the first metal layer.
7. The bond of claim 1 , wherein a width of the raised feature is about 5 microns and a height of the raised feature above a plane of the substrate is about 1 micron.
8. The bond of claim 1 , wherein a width of the first metal layer and the second metal layer is about 50 microns to about 200 microns, which defines a width of a bondline of the same dimension, about 50 microns to about 200 microns.
9. The bond of claim 1 , wherein the raised feature comprises at least one of a continuous perimeter and a plurality of discrete raised features spaced some distance apart from one another, around the device.
10. The bond of claim 1 , wherein the first metal layer and the second metal layer both comprise at least one of gold, aluminum and copper of a thickness between about 0.5 microns and 6 microns.