Multi-sized subscriber identity module card for use on multiple wireless devices

1. A subscriber identity module card for wireless devices, comprising:

a top surface;

a bottom surface;

a first memory card;

a first material layer arranged on the bottom surface of the first memory card, wherein the first material layer is configured to remain on the bottom surface of the first memory card to provide a first thickness of the first memory card;

a second memory card secured within the first memory card, said second memory card having said first material layer arranged on a bottom surface of said second memory card, wherein the first material layer is configured to remain on the bottom surface of the second memory card to provide the first thickness of the second memory card; and

a third memory card secured within the second memory card, said third memory card having a second material layer arranged on a bottom surface of said third memory card, wherein the second material layer is configured to be removed from the bottom surface of the third memory card to provide a second thickness of the third memory card,

wherein the first memory card and the first material layer comprises the first thickness, the second memory card and the first material layer comprises the first thickness, the third memory card without the second material layer comprises the second thickness;

wherein the first thickness is greater than the second thickness;

wherein the first material layer comprises a first adhesive and the second material layer comprises a second adhesive; and

wherein the first memory card with the first material layer, the second memory card with the first material layer, and the third memory card with the second material layer each have a thickness of 0.76 mm.

2. The subscriber identity module card of claim 1 , wherein the first memory card is attached to a package, the second memory card is attached to the first memory card, and the third memory card is attached to the second memory card by one or more connecting mechanisms;

wherein the first material layer is arranged on a bottom surface of the package;

wherein the first material layer is arranged on the bottom surface of the first memory card;

wherein the first material layer is arranged on the bottom surface of the second memory card;

wherein the second material layer is arranged on the bottom surface of the third memory card;

wherein the first memory card is configured to be detachable from the package and the first memory card together with the first material layer is configured as a Mini-SIM;

wherein the second memory card with the first material layer is configured to be detachable from the package and the second memory card together with the first material layer is configured as a Micro-SIM; and

wherein the third memory card is configured to be detachable from the subscriber identity module card to form a Nano-SIM with the second material layer removed.

3. The subscriber identity module card of claim 2 , wherein the first memory card is detachable from the package and the first memory card together with the first material layer is configured to be the Mini-SIM having a thickness of 0.76 mm that includes the thickness of the first memory card together with the first material layer.

4. The subscriber identity module card of claim 2 , wherein the second memory card with the first material layer is detachable from the package and the second memory card together with the first material is configured to be the Micro-SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer.

5. The subscriber identity module card of claim 1 , wherein the second memory card is detachable from the subscriber identity module card; and wherein the second memory card along with the first material layer comprises a Micro-SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer.

6. The subscriber identity module card of claim 5 , wherein the third memory card is detachable from the subscriber identity module card to form a Nano-SIM having a thickness of 0.67 mm that includes the thickness of the third memory card with the second material layer removed.

7. The subscriber identity module card of claim 1 ,

wherein the third memory card with the second material layer is configured to be detachable from the second memory card by a user; and

wherein the second material layer is configured to be detachable from the third memory card by the user to form a Nano-SIM having a thickness of 0.67 mm that includes the thickness of the third memory card with the second material layer removed.

8. A method of configuring a subscriber identity module card for wireless devices, comprising:

arranging a top surface on said subscriber identity module card;

arranging a bottom surface on said subscriber identity module card;

providing a first memory card;

arranging a first material layer on the bottom surface of the first memory card;

securing a second memory card within the first memory card;

arranging said first material layer on a bottom surface of said second memory card;

securing a third memory card within said second memory card;

arranging a second material layer on a bottom surface of said third memory card;

arranging the subscriber identity module card within a package with the first memory card, the second memory card and the third memory card;

removing the third memory card from the second memory card; and

removing the second material layer from the third memory card to form a Nano-SIM,

wherein the first memory card and the first material layer comprises a first thickness, the second memory card and the first material layer comprises the first thickness, the third memory card without the second material layer comprises a second thickness;

wherein the first thickness is greater than the second thickness;

wherein the first material layer comprises a first adhesive and the second material layer comprises a second adhesive; and

wherein the first memory card with the first material layer, the second memory card with the first material layer, and the third memory card with the second material layer each have a thickness of 0.76 mm.

9. The method of claim 8 , further comprising at least one of the following:

removing the first memory card from the subscriber identity module card with the first material layer intact to form a Mini-SIM having a thickness of 0.76 mm that includes the thickness of the first memory card together with the first material layer;

removing the second memory card from the subscriber identity module card with the first material layer intact to form a Micro-SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer; and

removing the third memory card from the subscriber identity module card and removing the second material layer to form a Nano-SIM having a thickness of 0.67 mm that includes the thickness of the third memory card with the second material layer removed.

10. The method of claim 8 , further comprising removing the first memory card from the subscriber identity module card with the first material layer intact to form a Mini-SIM having a thickness of 0.76 mm that includes the thickness of the first memory card together with the first material layer.

11. The method of claim 8 , further comprising removing the second memory card with the first material layer intact to form a Micro SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer.

12. The method of claim 8 , wherein a combined thickness of the third memory card and the second material layer is the same as the combined thickness of the first memory card and the first material layer,

wherein the first memory card with the first material layer, the second memory card with the first material layer, and the third memory card with the second material layer each have a thickness of 0.76 mm;

wherein the first material layer comprises the first adhesive and the second material layer comprises the second adhesive; and

wherein the first adhesive is more robust than the second adhesive.

13. The method of claim 8 , wherein arranging the subscriber identity module card within the package with the second memory card and the third memory card comprises attaching the subscriber identity module card to one or more connection mechanisms;

wherein the first memory card, the second memory card and the third memory card together with the first material layer each have a thickness of 0.76 mm;

wherein the first material layer comprises the first adhesive and the second material layer comprises the second adhesive; and

wherein the first adhesive is more robust than the second adhesive.

14. The method of claim 8 ,

wherein the first memory card, the second memory card and the third memory card together with the first material layer each have a thickness of 0.76 mm;

wherein the first memory card is detachable from the package and the first memory card together with the first material layer is configured to be a Mini-SIM having a thickness of 0.76 mm that includes the thickness of the first memory card together with the first material layer;

wherein the second memory card with the first material layer is detachable from the package and the second memory card together with the first material is configured to be a Micro-SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer; and

wherein the third memory card is detachable from the subscriber identity module card to form a Nano-SIM having a thickness of 0.67 mm that includes the thickness of the third memory card with the second material layer removed.

15. A subscriber identity module card for wireless devices, comprising:

a top surface;

a bottom surface;

a first memory card;

a first material layer arranged on the bottom surface of the first memory card, wherein the first material layer is configured to remain on the bottom surface of the first memory card to provide a first thickness of the first memory card;

a second memory card secured within the first memory card, said second memory card having said first material layer arranged on a bottom surface of said second memory card, wherein the first material layer is configured to remain on the bottom surface of the second memory card to provide a first thickness of the second memory card; and

a third memory card secured within said second memory card, said third memory card having a second material layer arranged on a bottom surface of said third memory card, wherein the second material layer is configured to be removed from the bottom surface of the third memory card to provide a second thickness of the third memory card,

wherein the first memory card is attached to a package, the second memory card is attached to the first memory card, and the third memory card is attached to the second memory card by one or more connecting mechanisms;

wherein the first memory card is detachable from the package;

wherein the subscriber identity module card and the second memory card with the first material layer and the third memory card with the second material layer are configured to be detachable from the package,

wherein the second memory card with the first material layer and the third memory card with the second material layer are detachable from the subscriber identity module card;

wherein the first memory card and the first material layer comprises the first thickness, the second memory card and the first material layer comprises the first thickness, the third memory card without the second material layer comprises a second thickness;

wherein the first thickness is greater than the second thickness;

wherein the first memory card with the first material layer, the second memory card with the first material layer, and the third memory card with the second material layer each have a thickness of 0.76 mm; and

wherein a first material layer comprises a first adhesive and a second material layer comprises a second adhesive.

16. The subscriber identity module card of claim 15 ,

wherein the first memory card is configured to be detachable from the package and the first memory card together with the first material layer is configured as a Mini-SIM;

wherein the second memory card with the first material layer is configured to be detachable from the package and the second memory card together with the first material layer is configured as a Micro-SIM;

wherein the third memory card is configured to be detachable from the subscriber identity module card to form a Nano-SIM with the second material layer removed; and

wherein the first material layer and the second material layer are each 0.09 mm in thickness.

17. The subscriber identity module card of claim 15 , wherein the first memory card is detachable from the package and the first memory card together with the first material layer is configured to be a Mini-SIM having a thickness of 0.76 mm that includes the thickness of the first memory card together with the first material layer.

18. The subscriber identity module card of claim 15 , wherein the second memory card with the first material layer is detachable from the package and the second memory card together with the first material layer is configured to be a Micro-SIM having a thickness of 0.76 mm that includes the thickness of the second memory card together with the first material layer.

19. The subscriber identity module card of claim 15 , wherein the third memory card is detachable from the subscriber identity module card to form a Nano-SIM having a thickness of 0.67 mm that includes the thickness of the third memory card with the second material layer removed.