Feature and depth measurement using multiple beam sources and interferometry
View Patent ↗Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.
1. A method for processing a workpiece, the method comprising:
causing emission of a multi-wavelength output beam from a wavelength beam combining (WBC) laser emitter, the multi-wavelength output beam comprising optical radiation having a plurality of wavelengths;
diverting a portion of the multi-wavelength output beam to a movable reflective surface;
diverting a portion of a reflection of the multi-wavelength output beam from a surface of the workpiece to a photodetector;
receiving, at the photodetector, a reflection from the movable reflective surface of the diverted portion of the multi-wavelength output beam;
computing a height or depth of a feature on the workpiece based at least in part on a signal from the photodetector; and
processing the workpiece with the multi-wavelength output beam to physically alter the workpiece, the workpiece being processed based at least in part on the computed height or depth of the feature on the workpiece.
2. The method of claim 1 , wherein, during the processing of the workpiece, one or more properties of the multi-wavelength output beam are controlled based at least in part on the computed height or depth of the feature on the workpiece.
3. The method of claim 2 , wherein the one or more properties of the multi-wavelength output beam comprise power.
4. The method of claim 2 , wherein the one or more properties of the multi-wavelength output beam comprise beam parameter product.
5. The method of claim 1 , wherein, during the processing of the workpiece, one or more properties of the multi-wavelength output beam are controlled based at least in part on one or more parameters relating properties of the multi-wavelength output beam to at least one of (i) process types or (ii) material properties.
6. The method of claim 5 , wherein the one or more properties of the multi-wavelength output beam comprise power.
7. The method of claim 5 , wherein the one or more properties of the multi-wavelength output beam comprise beam parameter product.
8. The method of claim 1 , wherein the movable reflective surface is reflective to all of the wavelengths of the multi-wavelength output beam.
9. The method of claim 1 , wherein the portion of the reflection of the multi-wavelength output beam from the surface of the workpiece that is diverted to the photodetector includes all of the wavelengths of the multi-wavelength output beam.
10. The method of claim 1 , wherein the height or depth of the feature is determined based on a distance between the surface of the workpiece and a location where the portion of the reflection is diverted.
11. The method of claim 1 , wherein the signal from the photodetector indicates a degree of interference between the reflection of the multi-wavelength output beam from the surface of the workpiece and the reflection, from the movable reflective surface, of the diverted portion of the multi-wavelength output beam.
12. The method of claim 1 , wherein the portion of the multi-wavelength output beam diverted to the movable reflective surface is diverted by a beamsplitter.
13. The method of claim 12 , further comprising, during at least a portion of the processing of the workpiece, maintaining a target distance between the beamsplitter and the surface of the workpiece.
14. The method of claim 13 , wherein the target distance is maintained at least in part by controlling one or more properties of the multi-wavelength output beam.
15. The method of claim 14 , wherein the one or more properties of the multi-wavelength output beam comprise power.
16. The method of claim 14 , wherein the one or more properties of the multi-wavelength output beam comprise beam parameter product.
17. The method of claim 1 , wherein processing the workpiece comprises at least one of cutting the workpiece, etching the workpiece, annealing the workpiece, drilling the workpiece, soldering the workpiece, or welding the workpiece.
18. The method of claim 1 , wherein the workpiece is processed in response to user selection of a material composition of the workpiece.
19. The method of claim 1 , wherein the feature has a height above the surface of the workpiece or has a depth below the surface of the workpiece.
20. The method of claim 1 , wherein the WBC laser emitter comprises:
a plurality of beam emitters each emitting a beam;
a combining optical element arranged to receive the plurality of beams and cause a chief ray of each of the beams to converge along a beam-combining axis;
a dispersive element, positioned along the beam-combining axis, to receive and transmit the converging chief rays; and
a partially reflective output coupler arranged to receive the transmitted beams from the dispersive element, to reflect a portion of the transmitted beams toward the dispersive element, and to transmit the multi-wavelength output beam.