Methods of forming structures for downhole applications

1. A method of forming a structure for a downhole application, comprising:

forming a precursor material by mixing at least one solvent and particles of one or more self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone, at least one of the particles functionalized with charged functional groups,

providing the precursor material between opposing surfaces of a first substrate and a second substrate, the first substrate and the second substrate each individually comprising one or more of diamond, a ceramic, a metal, a metal alloy, and a ceramic-metal composite material; and

removing the at least one solvent from the precursor material after providing the precursor material between the opposing surfaces of the first substrate and the second substrate to form an interfacial material between the first substrate and the second substrate, the interfacial material comprising greater than or equal to 90 wt % of a polymeric material including cross-linked polymer chains of the one or more of self-reinforced polyphenylene, the polyphenylene sulfide, the polysulfone, and the polyphenylsulfone.

2. The method of claim 1 , wherein the interfacial material comprises at least two of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone.

3. The method of claim 1 , wherein forming a precursor material comprises selecting the at least one solvent to comprise at least one of water, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, dimethylformamide, dimethylacetamide, pyridine, an-N-substituted pyrrole, a pyrrolidine, a piperidine, a morpholine, chloroform, 1-methoxy-2-propanol acetate, a glycol, a glycol ether, and an alcohol.

4. The method of claim 1 , wherein the precursor material further comprises at least one of a filler material, a cross-linking agent, and an adhesion promoter.

5. The method of claim 1 , wherein providing the precursor material between the opposing surfaces of the first substrate and the second substrate comprises:

positioning the second substrate over the first substrate; and

substantially simultaneously applying the precursor material over the opposing surfaces of the first substrate and the second substrate after positioning the second substrate over the first substrate.

6. The method of claim 1 , wherein providing the precursor material between the opposing surfaces of the first substrate and the second substrate comprises:

depositing the precursor material on at least one of the first substrate and the second substrate; and

adjoining the first substrate and the second substrate together with the deposited precursor material therebetween.

7. The method of claim 1 , wherein removing the at least one solvent from the precursor material comprises evaporating the at least one solvent from the precursor material.

8. The method of claim 1 , further comprising selecting the first substrate and the second substrate to each individually comprise one or more of a metal and a metal alloy.

9. The method of claim 1 , further comprising forming an adhesion promoter on at least one of the opposing surfaces of the first substrate and the second substrate prior to forming the interfacial material between the opposing surfaces of the first substrate and the second substrate.

10. The method of claim 1 , further comprising curing the interfacial material at a temperature within a range of from about 250° C. to about 400° C.

11. A method of forming a downhole structure, comprising:

mixing particles of two or more of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone with one or more of an aqueous solvent and an organic solvent to form a precursor material, at least one of the particles functionalized with charged functional groups;

providing the precursor material between opposing surfaces of a first substrate and a second substrate, the first substrate and the second substrate each individually comprising one or more of diamond, a ceramic material, a metal, an alloy, and a ceramic-metal composite material; and

solidifying the precursor material.

12. The method of claim 11 , wherein forming a precursor material comprises forming the precursor material to comprise self-reinforced polyphenylene and polyphenyl sulfone.

13. The method of claim 11 , wherein forming a precursor material comprises forming the precursor material to comprise self-reinforced polyphenylene including repeating units of one or more of 1,3-phenylene, benzoyl-1,4-phenylene, phenoxy-benzoyl-1,4-phenylene, and derivatives thereof.

14. The method of claim 11 , wherein forming a precursor material comprises forming the precursor material to further comprise one or more of carbon black, graphene, carbon nanofibers, single-walled carbon nanotubes, multi-walled carbon nanotubes, a polytetrafluoroethene filler, an aromatic polyamide filler, a slagwool filler, a cellulose filler, a poly(p-phenylene-2,6-benzobisoxazole) filler, a clay filler, and silica filler.

15. The method of claim 11 , wherein providing the precursor material between the opposing surfaces of a first substrate and a second substrate comprises providing the precursor material between opposing threaded surfaces of the first substrate and a second substrate.

16. A method of forming a downhole structure, comprising: forming a precursor material consisting of:

particles of at least one polymeric material selected from the group consisting of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone, a surface of at least one of the particles functionalized with charged functional groups;

at least one additive selected from the group consisting of carbon black, graphene, carbon nanofibers, single-walled carbon nanotubes, multi-walled carbon nanotubes, a polytetrafluoroethene filler, an aromatic polyamide filler, a slagwool filler, a cellulose filler, a poly(p-phenylene-2,6-benzobisoxazole) filler, a clay filler, and silica filler; and

at least one solvent selected from the group consisting of water, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, diemethylformamide, dimethylacetamide, pyridine, a N-substituted pyrrole, a pyrrolidine, a piperidine, a morpholine, chloroform, 1-methoxy-2-propanol acetate, a glycol, a glycol ether, and an alcohol;

providing the precursor material between a first substrate and a second substrate; and

removing the at least one solvent of the precursor material to form an interfacial material indirectly adhering the first substrate to the second substrate.