Granted Patent B2

US 10,811,662 · App. 15/641,864 · Granted Oct 20, 2020

Inventors: Heiner Fees (Bietigheim-Bissingen, DE); Andreas Track (Sachsenheim, DE); Alexander Eichhorn (Eppingen, DE); Ralf Maisch (Abstatt, DE); Jörg Damaske (Freiberg, DE); Martin Eberhard (Woodside, CA)

Assignee: TIVENI MERGECO, INC.

H01M2/206B23K26/21B23K26/26B60L50/64B60L58/21H01M2/022H01M2/023H01M2/027H01M2/0237H01M2/0262H01M2/0267H01M2/043H01M2/046H01M2/0413H01M2/1077H01M2/22H01M2/24H01M2/30H01M2/305H01M10/613H01M10/625B23K2101/36B23K2101/38B60K2001/005H01M2/34H01M10/643H01M10/6552H01M2200/103H01M2220/20

Abstract

Claims (38)

1. A contact plate configured to establish electrical bonds between battery cells in a battery module, comprising:

at least one primary conductive layer; and

a set of bonding connectors that are configured to provide direct electrical bonds between the contact plate and terminals of a group of battery cells, the set of bonding connectors being configured to connect the group of battery cells in parallel with each other,

wherein at least one bonding connector in the set of bonding connectors is configured with a higher fuse rating than each other bonding connector in the set of bonding connectors so as to contain arcs among the set of bonding connectors to the at least one bonding connector, and

wherein the at least one bonding connector with the higher fuse rating includes a given section that has a different resistance relative to a remainder of the respective bonding connector so as to contain arcs in the respective bonding connector to the given section.

2. The contact plate of claim 1 , wherein the at least one bonding connector includes a single bonding connector.

3. The contact plate of claim 1 , wherein the higher fuse rating of the at least one bonding connector is configured based on a material used in the at least one bonding connector, a geometry of the at least one bonding connector, or a combination thereof.

4. The contact plate of claim 3 , wherein the material used in the at least one bonding connector is different relative to a material used in each other bonding connector in the set of bonding connectors.

5. The contact plate of claim 4 , wherein the material used in the at least one bonding connector has a higher resistance relative to the material used in each other bonding connector in the set of bonding connectors.

6. The contact plate of claim 3 , wherein the material used in the at least one bonding connector is also used in each other bonding connector in the set of bonding connectors.

7. The contact plate of claim 3 , wherein the geometry of the at least one bonding connector is different than a geometry of each other bonding connector in the set of bonding connectors.

8. The contact plate of claim 7 , wherein the geometry of the at least one bonding connector has a higher length, a different shape, a higher thickness or any combination thereof relative to the geometry of each other bonding connector in the set of bonding connectors.

9. The contact plate of claim 7 , wherein the material used in the at least one bonding connector is different relative to a material used in each other bonding connector in the set of bonding connectors.

10. The contact plate of claim 3 , wherein the geometry of the at least one bonding connector is the same as a geometry of each other bonding connector in the set of bonding connectors.

11. The contact plate of claim 1 ,

wherein the contact plate is configured as a multi-layer contact plate that includes:

the at least one primary conductive layer,

a cell terminal connection layer that is joined with the at least one primary conductive layer,

wherein the set of bonding connectors is formed from the cell terminal connection layer.

12. The contact plate of claim 1 , wherein one or more arc protection mechanisms are configured in proximity to the at least one bonding connector.

13. The contact plate of claim 12 , wherein the one or more arc protection mechanisms are not configured in proximity any other bonding connector among the set of bonding connectors.

14. The contact plate of claim 12 ,

wherein an insulation layer is mounted on top of the contact plate,

wherein at least one hole is configured within the insulation layer that exposes the at least one bonding connector, and

wherein the one or more arc protection mechanisms include the at least one hole being filled with a protective compound that is configured to protect against arcs.

15. The contact plate of claim 14 , wherein the protective compound includes quartz sand, red phosphor gel, or any combination thereof.

16. The contact plate of claim 12 , wherein the one or more arc protection mechanisms include a magnetic field configured to interrupt an arc.

17. The contact plate of claim 12 , wherein the one or more arc protection mechanisms include increased air flow configured to interrupt an arc.

18. The contact plate of claim 12 ,

wherein the one or more arc protection mechanisms are applied to the given section of each bonding connector among the among the at least one bonding connector.

19. The contact plate of claim 18 , wherein the given section of each bonding connector among the at least one bonding connector is thinner than one or more other sections of each bonding connector among the at least one bonding connector.

20. A contact plate configured to establish electrical bonds between battery cells in a battery module, comprising:

at least one primary conductive layer; and

a set of bonding connectors that are configured to provide direct electrical bonds between the contact plate and terminals of a group of battery cells, the set of bonding connectors being configured to connect the group of battery cells in parallel with each other,

wherein at least one bonding connector in the set of bonding connectors is configured with a higher fuse rating than each other bonding connector in the set of bonding connectors so as to contain arcs among the set of bonding connectors to the at least one bonding connector,

wherein the at least one primary conductive layer comprises first and second primary conductive layers,

wherein the set of bonding connectors is integrated as part of a cell terminal connection layer that is partially sandwiched by the first and second primary conductive layers, and

wherein each bonding connector among the at least one bonding connector includes a given section that has a different resistance relative to a remainder of the respective bonding connector and is also separate from a terminal-contacting part of the respective bonding connector.

Assignments (8)

Continuity (10)