Semiconductor light emitting device and method of fabricating the same
A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.
1. A semiconductor light-emitting device, comprising:
a substrate;
a first adhesive layer on the substrate;
multiple epitaxial units on the first adhesive layer;
a second adhesive layer on the multiple epitaxial units;
multiple first electrodes between the first adhesive layer and the multiple epitaxial units, wherein each of the first electrodes contacts the first adhesive layer and a corresponding one of the multiple epitaxial units; and
multiple second electrodes between the second adhesive layer and the multiple epitaxial units, wherein each of the second electrodes contacts the second adhesive layer and a corresponding one of the multiple epitaxial units;
wherein the multiple epitaxial units are spaced apart from each other.
2. The semiconductor light-emitting device according to claim 1 , wherein the first adhesive layer comprises multiple sub adhesive layers corresponding to the multiple epitaxial units respectively.
3. The semiconductor light-emitting device according to claim 1 , wherein the first electrodes comprise a metal material.
4. The semiconductor light-emitting device according to claim 3 , wherein the metal material comprises Au, Ag, Cu, Al, Pt, Ni, Ti or Sn.
5. The semiconductor light-emitting device according to claim 1 , wherein the second adhesive layer comprises a first portion and a second portion, and the first portion and the second portion are totally separated.
6. The semiconductor light-emitting device according to claim 1 , wherein the second adhesive layer comprises ITO, IZO, InO, SnO, FTO, ATO, CTO, AZO, GZO or the combination thereof.
7. The semiconductor light-emitting device according to claim 1 , wherein the second adhesive layer comprises Ti, Au, Be, W, Al, Ge, Cu, or the combination thereof.
8. The semiconductor light-emitting device according to claim 1 , further comprising a patterned layer in the first adhesive layer.
9. The semiconductor light-emitting device according to claim 8 , wherein the patterned layer comprises dielectric material.
10. The semiconductor light-emitting device according to claim 1 , wherein the epitaxial unit comprises:
a first type conductivity semiconductor layer on the first substrate;
a second type conductivity semiconductor layer on the first type conductivity semiconductor layer; and
an active layer between the first type conductivity semiconductor layer and the second type conductivity semiconductor layer.
11. The semiconductor light-emitting device according to claim 1 , wherein the second electrodes comprise metal material.
12. The semiconductor light-emitting device according to claim 11 , wherein the metal material comprises Au, Ag, Cu, Al, Pt, Ni, Ti or Sn.
13. A method for forming semiconductor light-emitting device, comprising the steps of:
providing a semiconductor epitaxial stack;
forming multiple first electrodes on the semiconductor epitaxial stack;
providing a substrate;
adhering the semiconductor epitaxial stack to the substrate with a first adhesive layer;
forming multiple second electrodes on the semiconductor epitaxial stack;
forming a second adhesive layer on the semiconductor epitaxial stack; and
dividing the semiconductor epitaxial stack to multiple epitaxial units;
wherein each of the first electrodes contacts the first adhesive layer and a corresponding one of the multiple epitaxial units, and each of the second electrodes contacts the second adhesive layer and a corresponding one of the multiple epitaxial units.
14. The semiconductor light-emitting device according to claim 13 , wherein the first adhesive layer is formed on the substrate by spin coating or deposition prior to the adhering step.
15. The semiconductor light-emitting device according to claim 13 , wherein the dividing step is conducted by dry etching.
16. A semiconductor light-emitting device, comprising:
a substrate;
a first adhesive layer on the substrate;
a first epitaxial unit on the first adhesive layer;
a second epitaxial unit on the first adhesive layer and spaced apart from the first epitaxial unit;
a second adhesive layer on the first epitaxial unit and the second epitaxial unit;
a first electrode between the first adhesive layer and the first epitaxial unit; and
a second electrode between the second adhesive layer and the first epitaxial unit,
wherein the second adhesive layer comprises ITO, IZO, InO, SnO, FTO, ATO, CTO, AZO, GZO or the combination thereof.
17. The semiconductor light-emitting device according to claim 16 , wherein one of the first epitaxial unit and the second epitaxial unit comprises:
a first type conductivity semiconductor layer on the first substrate;
a second type conductivity semiconductor layer on the first type conductivity semiconductor layer; and
an active layer between the first type conductivity semiconductor layer and the second type conductivity semiconductor layer.
18. The semiconductor light-emitting device according to claim 16 , wherein the second adhesive layer comprises a first portion and a second portion, and the first portion and the second portions are totally separated.
19. The semiconductor light-emitting device according to claim 16 , wherein the first adhesive layer comprises a first sub adhesive layer between the first epitaxial unit and the substrate and having a width greater than that of the first electrode.
20. The semiconductor light-emitting device according to claim 16 , wherein the second electrode has a side surface covered by the second adhesive layer.