DISPLAY DEVICES AND METHODS FOR FORMING THE SAME
A display device is provided. The display device includes a first conductive pad disposed on a substrate, wherein the first conductive pad has a contact area that is adjacent to the substrate. The display device also includes a first bonding material disposed on the first conductive pad, wherein the first bonding material has a sectional area that is parallel to a surface of the substrate. The display device further includes a second conductive pad disposed on the first bonding material, and a first illumination structure disposed on the second conductive pad, wherein the sectional area of the first bonding material is smaller than the contact area of the first conductive pad.
1 . A display device, comprising:
a first conductive pad disposed on a substrate, wherein the first conductive pad has a contact area that is adjacent to the substrate;
a first bonding material disposed on the first conductive pad, wherein the first bonding material has a sectional area that is parallel to a surface of the substrate;
a second conductive pad disposed on the first bonding material; and
a first illumination structure disposed on the second conductive pad,
wherein the sectional area of the first bonding material is smaller than the contact area of the first conductive pad.
2 . The display device as claimed in claim 1 , wherein the sectional area is located in a range from the center of the first bonding material plus 15% of a thickness of the first bonding material upward or downward.
3 . The display device as claimed in claim 1 , wherein the first bonding material has a concave cross-sectional contour.
4 . The display device as claimed in claim 1 , wherein the first bonding material has a gap or a hole therein.
5 . The display device as claimed in claim 1 , further comprising:
a third conductive pad disposed on the substrate;
a second bonding material disposed on the third conductive pad, wherein the second bonding material has a convex cross-sectional contour;
a fourth conductive pad disposed on the second bonding material; and
a second illumination structure disposed on the fourth conductive pad.
6 . The display device as claimed in claim 5 , wherein the first bonding material has a thickness that is greater than the thickness of the second bonding material.
7 . The display device as claimed in claim 5 , wherein the first illumination structure has a thickness that is less than the thickness of the second illumination structure.
8 . The display device as claimed in claim 5 , wherein the second bonding material has a gap or a hole therein.
9 . A display device, comprising:
a first conductive pad disposed on a substrate;
a first bonding material disposed on the first conductive pad;
a second conductive pad disposed on the first bonding material;
a first illumination structure disposed on the second conductive pad; and
a first spacer disposed between the substrate and the first illumination structure.
10 . The display device as claimed in claim 9 , wherein the first spacer is in contact with the substrate or the first illumination structure, and the first spacer has a thickness that is less than the sum of the thicknesses of the first conductive pad, the first bonding material and the second conductive pad.
11 . The display device as claimed in claim 9 , wherein a portion of the first spacer extends between the first conductive pad and the second conductive pad, the portion of the first spacer is in contact with the first conductive pad or the second conductive pad, and the portion of the first spacer has a thickness that is less than the thickness of the first bonding material.
12 . The display device as claimed in claim 9 , further comprising:
a third conductive pad disposed on the substrate;
a second bonding material disposed on the third conductive pad, wherein the first bonding material has a thickness that is greater than the thickness of the second bonding material;
a fourth conductive pad disposed on the second bonding material;
a second illumination structure disposed on the fourth conductive pad; and
a second spacer disposed between the substrate and the second illumination structure.
13 . The display device as claimed in claim 12 , wherein two sides of the second spacer are respectively in contact with the substrate and the second illumination structure, and the second spacer has a thickness that is equal to the sum of the thicknesses of the third conductive pad, the second bonding material and the fourth conductive pad.
14 . The display device as claimed in claim 12 , wherein a portion of the second spacer extends between the third conductive pad and the fourth conductive pad, the second spacer is in contact with the substrate or the second illumination structure, and two sides of the portion of the second spacer are respectively in contact with the third conductive pad and the fourth conductive pad.
15 . The display device as claimed in claim 9 , further comprising:
a glue coating disposed between the substrate and the first illumination structure, wherein the first bonding material is disposed in the glue coating, and the first bonding material is globular in shape.
16 . The display device as claimed in claim 15 , wherein the first spacer is globular and disposed in the glue coating, and the first spacer is in contact with the first conductive pad and the second conductive pad.
17 . A method for forming a display device, comprising:
forming a first conductive pad on a substrate, wherein the first conductive pad has a contact area that is adjacent to the substrate;
forming a second conductive pad on a first illumination structure;
forming a first bonding material on the first conductive pad, wherein the first bonding material has a sectional area that is parallel to a surface of the substrate, the sectional area of the first bonding material is smaller than the contact area of the first conductive pad; and
performing a bonding process to bond the first illumination structure to the substrate.
18 . The method as claimed in claim 17 , further comprising:
before performing the bonding process, forming a first spacer on the substrate or the first illumination structure, wherein the first bonding material has a thickness that is greater than the thickness of the first spacer, and wherein after performing the bonding process, a side of the first spacer is in contact with the substrate, and the other side of the first spacer is in contact with the first illumination structure.
19 . A method for forming a display device, comprising:
forming a first conductive pad on a substrate;
forming a second conductive pad on an illumination structure;
forming a spacer on the substrate or the illumination structure;
forming a glue coating on the substrate and the first conductive pad;
forming a bonding material on the glue coating, and the bonding material is embedded in the glue coating, wherein the bonding material has a thickness that is greater than the thickness of the spacer; and
performing a bonding process to bond the illumination structure to the substrate.
20 . A method for forming a display device, comprising:
forming a first conductive pad on a substrate;
forming a second conductive pad on an illumination structure;
forming a glue coating on the substrate and the first conductive pad, or forming the glue coating on the illumination structure and the second conductive pad, wherein the glue coating has a spacer therein;
forming a bonding material on the glue coating, and the bonding material is embedded in the glue coating, wherein the bonding material has a thickness that is greater than the thickness of the spacer; and
performing a bonding process to bond the illumination structure to the substrate.