IP Library Granted Patent US 10,743,438
Granted Patent B2
US 10,743,438 · App. 15/645,362 · Granted Aug 11, 2020

Liquid cooling device, liquid cooling system, and control method of liquid cooling device

Inventors: Yukiko Wakino (Sagamihara, JP); Satoshi Inano (Minoh, JP); Hiroyuki Fukuda (Yokohama, JP); Hiroyoshi Kodama (Isehara, JP); Minoru Ishinabe (Atsugi, JP)
Assignee: FUJITSU LIMITED
H05K7/20236H05K7/20272H05K7/20772
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Quick Facts
Patent No.
US 10,743,438
App. No.
15/645,362
Granted
Aug 11, 2020
Kind
B2
Abstract

An apparatus includes: a cooling medium bath configured to house a first refrigerant in which an electronic device is immersed; a liquid-cooling jacket configured to be provided to the electronic device and to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket; a first pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket; a second pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and a circulator configured to cause the first refrigerant in the cooling medium bath to stream.

Claims (44)

1. A liquid cooling device, comprising:

a cooling medium bath configured to house a first refrigerant in which an electronic device is directly immersed;

a liquid-cooling jacket configured to be provided adjacent to the electronic device and to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket, the second refrigerant being different from the first refrigerant and the second refrigerant having a higher thermal conductivity than the first refrigerant;

a first pipe configured to be provided the cooling medium bath, to be directly immersed in the first refrigerant, and to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket;

a second pipe configured to be provided to the cooling medium bath, to be directly immersed in the first refrigerant, and to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and

a circulator configured to cause the first refrigerant in the cooling medium bath to stream.

2. The liquid cooling device according to claim 1 , wherein the circulator is provided in the cooling medium bath and has a liquid-current generator configured to cause the first refrigerant to stream.

3. The liquid cooling device according to claim 2 , wherein the liquid-current generator causes the first refrigerant to stream toward the first pipe or the second pipe or a combination thereof.

4. The liquid cooling device according to claim 2 , wherein the liquid-current generator is arranged in a lower section of the cooling medium bath and causes the first refrigerant to stream upward.

5. The liquid cooling device according to claim 2 , wherein the first pipe and the second pipe are arranged above the liquid-current generator.

6. The liquid cooling device according to claim 1 , wherein the circulator includes

a first circulating pipe configured to have both ends thereof coupled with the cooling medium bath, and

a streaming pump coupled to the first circulating pipe and configured to deliver the first refrigerant in the first circulating pipe to the cooling medium bath via one end of the first circulating pipe.

7. The liquid cooling device according to claim 6 , wherein

the one end of the first circulating pipe is coupled with the cooling medium bath below the first pipe and the second pipe, and

the other end of the first circulating pipe is coupled with the cooling medium bath above the first pipe and the second pipe.

8. The liquid cooling device according to claim 6 , wherein the other end of the first circulating pipe is coupled with the cooling medium bath above the one end of the first circulating pipe.

9. The liquid cooling device according to claim 1 , wherein the first pipe and the second pipe include metal pipes.

10. The liquid cooling device according to claim 9 , wherein the metal pipes are formed of copper or aluminium.

11. The liquid cooling device according to claim 1 , further comprising:

a connection pipe configured to couple the second pipe and the first pipe together; and

a refrigerant condenser coupled to the connection pipe and configured to cool the second refrigerant that flows in the connection pipe.

12. The liquid cooling device according to claim 11 , further comprising:

a pump coupled to the connection pipe and configured to deliver the second refrigerant in the connection pipe to the first pipe.

13. The liquid cooling device according to claim 11 , wherein the first pipe, the second pipe, and the connection pipe form second circulating pipe configured to circulate the second refrigerant between the liquid-cooling jacket and the refrigerant condenser.

14. The liquid cooling device according to claim 1 , wherein

the first pipe is arranged in a lower section of the cooling medium bath, and

the second pipe is arranged in an upper section of the cooling medium bath.

15. The liquid cooling device according to claim 1 , wherein the first refrigerant is an inactive refrigerant configured to have electrical insulating properties.

16. The liquid cooling device according to claim 1 , wherein the second refrigerant is water.

17. The liquid cooling device according to claim 1 , wherein the liquid-cooling jacket is arranged above the electronic device.

18. A liquid cooling system, comprising:

an electronic device;

a cooling medium bath configured to house a first refrigerant in which the electronic device is directly immersed;

a liquid-cooling jacket coupled adjacent to the electronic device and configured to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket, the second refrigerant being different from the first refrigerant and the second refrigerant having a higher thermal conductivity than the first refrigerant;

a first pipe coupled to the cooling medium bath, to be directly immersed in the first refrigerant, and configured to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket;

a second pipe coupled to the cooling medium bath, to be directly immersed in the first refrigerant, and configured to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and

a circulator configured to cause the first refrigerant in the cooling medium bath to stream.

19. A control method of a liquid cooling device configured to include a cooling medium bath configured to house a first refrigerant in which an electronic device is directly immersed and a liquid-cooling jacket coupled adjacent to the electronic device and configured to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket, the control method comprising:

supplying the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket by a first pipe coupled to the cooling medium bath and configured to be directly immersed in the first refrigerant;

discharging the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath by a second pipe coupled to the cooling medium bath and configured to be directly immersed in the first refrigerant; and

causing the first refrigerant in the cooling medium bath to stream by a circulator configured to be included in the liquid cooling device, wherein

the second refrigerant is different from the first refrigerant, and

the second refrigerant has a higher thermal conductivity than the first refrigerant.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2017
From: WAKINO, YUKIKO; INANO, SATOSHI; FUKUDA, HIROYUKI; KODAMA, HIROYOSHI; ISHINABE, MINORU
To: FUJITSU LIMITED
Reel/Frame 042953/0588 →
Priority Claims (1)
JP 2016-145562 · Jul 25, 2016 · national
Continuity (1)
Related Publication 20180027695A1 · Jan 25, 2018
Cited By (6)
US 1,124,280 US 12,309,975 US 12,389,566 US 12,414,273 US 12,513,853 US 12,526,954