IP Library Granted Patent US 10,056,732
Granted Patent B2
US 10,056,732 · App. 15/648,317 · Granted Aug 21, 2018

Mechanically isolated optically pumped semiconductor laser

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Quick Facts
Patent No.
US 10,056,732
App. No.
15/648,317
Granted
Aug 21, 2018
Kind
B2
Abstract

A housing for an optically pumped semiconductor (OPS) laser resonator is terminated at one end thereof by an OPS-chip. The laser resonator is assembled on a platform with the OPS-chip at one end of the platform. The platform is fixedly attached to a baseplate at the OPS-chip end of the platform. The remainder of the platform extends over the baseplate with a gap between the platform and the baseplate. A pump-laser is mounted directly on the baseplate and delivers pump radiation to the OPS-chip.

Claims (12)

1. Laser apparatus, comprising:

a cantilever platform having first and second opposite ends;

a baseplate having first and second opposite surfaces;

an optically pumped semiconductor (OPS) laser-resonator including an OPS-chip, the OPS laser-resonator assembled on the cantilever platform with the OPS-chip bonded to a heat-sink attached to the first end of the cantilever platform;

wherein the first end of the cantilever platform is supported on the baseplate, and a remaining portion of cantilever platform including the second end thereof extends over the baseplate with a gap between the remaining portion of the cantilever platform and the baseplate; and

wherein a pump-radiation source is mounted on the first surface of the baseplate and arranged to deliver optical pump radiation to the OPS-chip for energizing the OPS laser-resonator.

2. The apparatus of claim 1 , wherein the gap between the remaining portion of the cantilever platform and the baseplate is provided by a trough formed in the first surface of the baseplate.

3. The apparatus of claim 2 , wherein the cantilever platform is rectangular and the trough is rectangular.

4. The apparatus of claim 1 , wherein the pump radiation source includes a diode-laser.

5. The apparatus of claim 1 , wherein the laser resonator is a folded laser resonator.

6. The apparatus of claim 1 , further including a heat-sink attached to the second surface of the baseplate.

7. The apparatus of claim 1 wherein one end of the laser-resonator terminates in the OPS-chip.

Assignments (2)
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2017
From: WISDOM, JEFFREY ALAN
To: COHERENT, INC.
Reel/Frame 043117/0289 →