IP Library Granted Patent US 10,749,309
Granted Patent B2
US 10,749,309 · App. 15/648,885 · Granted Aug 18, 2020

Compact optical fiber amplifier

Inventors: Eric Timothy Green (Corning, NY); Daniel Christopher Myers (Elmira, NY); Todd Gregory Starner (Corning, NY); Martin Richard Williams (Big Flats, NY); Mark Filipowicz (Scotts Valley, CA)
Assignee: II-VI Incorporated
H01S3/06754H01S3/06704H01S3/1608H01S3/302G02B6/36G02B6/4457G02B6/4458
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Quick Facts
Patent No.
US 10,749,309
App. No.
15/648,885
Granted
Aug 18, 2020
Kind
B2
Abstract

A fiber-based optical amplifier is assembled in a compact configuration by utilizing a flexible substrate to support the amplifying fiber as flat coils that are “spun” onto the substrate. The supporting structure for the amplifying fiber is configured to define the minimal acceptable bend radius for the fiber, as well as the maximum diameter that fits within the overall dimensions of the amplifier package. A pressure-sensitive adhesive coating is applied to the flexible substrate to hold the fiber in place. By using a flexible material with an acceptable insulative quality (such as a polyimide), further compactness in the final assembly is achieved by locating the electronics in a space underneath the fiber enclosure.

Claims (14)

1. An optical fiber coil support structure comprising

a fiber containment component including a central bobbin forming a boundary defining a minimum bend radius diameter of a fiber wound into a coil form around the central bobbin, and an outer boundary element forming a boundary defining a maximum diameter of a fiber coil;

a bottom support sheet attached to a bottom surface of the fiber containment component; and

a top support sheet disposed attached to a top surface of the outer boundary element and sized to slightly overhang a width of the outer boundary element, leaving exposed both a major extent of an interior portion of the bottom support sheet, and also the central bobbin, wherein additional lengths of fiber splices may be disposed underneath the overhanging width of the top support sheet.

2. The optical fiber coil support structure of claim 1 wherein the bottom support sheet is welded to the fiber containment component.

3. The optical fiber coil support structure of claim 1 wherein the bottom and top support sheets are welded to the outer boundary element.

4. The optical fiber coil support structure of claim 1 wherein the top support sheet is formed to include one or more slots to provide access to the fiber coil within the fiber coil support structure.

5. The optical fiber coil support structure of claim 1 wherein the bottom support sheet is formed of a plastic material.

6. The optical fiber coil support structure of claim 5 wherein the plastic material is selected from the group consisting of polyimide, polycarbonate, polyvinylchloride.

7. The optical fiber coil support structure of claim 1 wherein the top support sheet is formed of a transparent material.

8. The optical fiber coil support structure of claim 7 wherein the top support sheet is formed of a transparent plastic material.

9. The optical fiber coil support structure of claim 1 wherein the outer boundary element includes channels for supporting lengths of optical fiber entering and exiting the fiber coil support structure.

10. The optical fiber coil support structure of claim 1 wherein the central bobbin of the fiber containment component exhibits a circular outer periphery.

11. The optical fiber coil support structure of claim 1 wherein the outer boundary element of the fiber containment component exhibits a circular inner periphery.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 19, 2019
From: II-VI INCORPORATED
To: II-VI DELAWARE, INC.
Reel/Frame 048631/0234 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2017
From: GREEN, ERIC TIMOTHY; MYERS, DANIEL CHRISTOPHER; STARNER, TODD GREGORY; WILLIAMS, MARTIN RICHARD; FILIPOWICZ, MARK
To: II-VI INCORPORATED
Reel/Frame 042999/0406 →
Continuity (3)
Continuation In Part 15071296 · Mar 16, 2016
Provisional Application 62135641 · Mar 19, 2015
Related Publication 20170317463A1 · Nov 2, 2017