Optoelectronic component and method for the production thereof
View Patent ↗An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, the first and second leadframe sections are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible at an underside, and a solder stop element is arranged at the underside of the housing, the solder stop element extending between the first soldering contact pad and the second soldering contact pad.
1. An optoelectronic component comprising:
an optoelectronic semiconductor chip comprising a first electrical contact and a second electrical contact,
a first leadframe section comprising a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and
a second leadframe section comprising a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad,
wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad,
the first leadframe section and the second leadframe section are embedded into a housing such that at least parts of the first soldering contact pad and the second soldering contact pad are accessible at an underside of the housing,
a solder stop element is arranged at the underside of the housing, said solder stop element extending between the first soldering contact pad and the second soldering contact pad,
the housing comprises a cavity at a top side situated opposite the underside,
at least parts of the first chip contact pad and of the second chip contact pad are accessible in the cavity,
the optoelectronic semiconductor chip is arranged in the cavity, and
the optoelectronic semiconductor chip is arranged above the first leadframe section and above the second leadframe section.
2. The optoelectronic component according to claim 1 , wherein the first chip contact pad and the second chip contact pad comprise a distance of less than 200 μm.
3. The optoelectronic component according to claim 1 , wherein the solder stop element partly covers the first soldering contact pad and/or the second soldering contact pad.
4. The optoelectronic component according to claim 1 , wherein the solder stop element comprises an edge length of at least 200 μm.
5. The optoelectronic component according to claim 1 , wherein the first soldering contact pad and the second soldering contact pad terminate flush with the underside of the housing.
6. The optoelectronic component according to claim 1 , wherein a potting material is arranged in the cavity.
7. The optoelectronic component according to claim 1 , wherein the first electrical contact and the second electrical contact are arranged on a common surface of the optoelectronic semiconductor chip.
8. The optoelectronic component according to claim 7 , wherein the optoelectronic semiconductor chip is a volume emitting sapphire flip-chip.
9. The optoelectronic component according to claim 1 , wherein the first electrical contact and the second electrical contact are arranged on a common surface of the optoelectronic semiconductor chip, and the surface of the optoelectronic semiconductor chip comprising the electrical contacts faces the chip contact pads.