Lens heatsink insert
Techniques disclosed herein relate to molding inserts with improved cooling performance. A mold insert includes a body and a plurality of heat sink elements coupled to the body. The body includes an area with a recessed surface that has different depths in a plurality of different regions. The plurality of heat sink elements is configured to provide different thermal resistances in the plurality of different regions of the mold insert, where a thermal resistance of the mold insert in a region with a higher recessed surface depth is lower than a thermal resistance of the mold insert in a region with a lower recessed surface depth. In some embodiments, the plurality of heat sink elements form cooling channels that are configured to conduct a cooling fluid from regions of the mold insert with higher recessed surface depths to regions of the mold insert with lower recessed surface depths.
1. A mold insert comprising:
a body including an area with a recessed surface; and
a plurality of heat sink elements coupled to the body,
wherein:
the recessed surface has different depths in a plurality of different regions of the mold insert; and
the plurality of heat sink elements are configured to provide different thermal resistances in the plurality of different regions of the mold insert,
wherein a thermal resistance of the mold insert including the body and the plurality of heat sink elements in a region with a higher recessed surface depth is lower than a thermal resistance of the mold insert in a region with a lower recessed surface depth such that the recessed surface of the body at the region with the higher recessed surface depth and the recessed surface of the body at the region with the lower recessed surface depth are in thermal equilibrium during a cooling process.
2. The mold insert of claim 1 , wherein the plurality of heat sink elements include heat sink elements of different dimensions, structures, shapes, or separation distances.
3. The mold insert of claim 1 , wherein the plurality of heat sink elements include a plurality of pins, rods, spikes, straight fins, or flared fins.
4. The mold insert of claim 1 , wherein at least some of the heat sink elements have uneven surfaces.
5. The mold insert of claim 1 , wherein at least some of the heat sink elements include internal tunnels for conducting a cooling fluid.
6. The mold insert of claim 1 , wherein a ratio between a maximum depth of the recessed surface and a minimum depth of the recessed surface is greater than 3.
7. The mold insert of claim 1 , wherein:
the recessed surface has a maximum depth in a center region of the mold insert; and
the mold insert includes a conduit for conducting a cooling fluid to the mold insert, the conduit located in the center region of the mold insert.
8. The mold insert of claim 7 , wherein:
the cooling fluid includes an air or a liquid.
9. The mold insert of claim 7 , wherein:
the plurality of heat sink elements are configured to form paths for conducting the cooling fluid from the center region to edges of the mold insert.
10. The mold insert of claim 9 , wherein the paths include radial paths or a spiral path.
11. The mold insert of claim 1 , wherein a total thermal resistance in any region within the area with the recessed surface is in a range between 95% and 105% of a threshold value, the total thermal resistance in a region including the thermal resistance of the mold insert in the region and a thermal resistance of a component to be molded with the mold insert in the region.
12. The mold insert of claim 1 , wherein at least some heat sink elements from the plurality of heat sink elements that are near edges of the mold insert are coated with a phase-change material.
13. The mold insert of claim 1 , wherein the mold insert is manufactured using a three-dimensional printing process.
14. A molding system comprising:
a mold insert comprising:
a body including an area with a recessed surface; and
a plurality of heat sink elements coupled to the body,
wherein:
the recessed surface has different depths in a plurality of different regions of the mold insert; and
the plurality of heat sink elements are configured to provide different thermal resistances in the plurality of different regions of the mold insert,
wherein a thermal resistance of the mold insert including the body and the plurality of heat sink elements in a region with a higher recessed surface depth is lower than a thermal resistance of the mold insert in a region with a lower recessed surface depth such that the recessed surface of the body at the region with the higher recessed surface depth and the recessed surface of the body at the region with the lower recessed surface depth are in thermal equilibrium during a cooling process.
15. The molding system of claim 14 , wherein the plurality of heat sink elements include heat sink elements of different dimensions, structures, shapes, or separation distances.
16. The molding system of claim 14 , wherein the plurality of heat sink elements are configured to form paths for conducting a cooling fluid from a center region of the mold insert to edges of the mold insert.
17. The molding system of claim 14 , wherein a total thermal resistance in any region within the area with the recessed surface is in a range between 95% and 105% of a threshold value, the total thermal resistance in a region including the thermal resistance of the mold insert in the region and a thermal resistance of a component to be molded with the mold insert in the region.
18. A method of molding an optical device, the method comprising:
providing a mold insert, the mold insert comprising a body and a plurality of heat sink elements coupled to the body, wherein:
the body including an area with a recessed surface;
the recessed surface has different depths in a plurality of different regions of the mold insert;
the plurality of heat sink elements are configured to provide different thermal resistances in the plurality of different regions of the mold insert; and
a thermal resistance of the mold insert including the body and the plurality of heat sink elements in a region with a higher recessed surface depth is lower than a thermal resistance of the mold insert in a region with a lower recessed surface depth such that the recessed surface of the body at the region with the higher recessed surface depth and the recessed surface of the body at the region with the lower recessed surface depth are in thermal equilibrium during a cooling process;
providing a melted material in the mold insert;
allowing the melted material to cool down; and
removing the optical device from the mold insert.
19. The method of claim 18 , wherein:
the recessed surface has a maximum depth in a center region of the mold insert;
the plurality of heat sink elements form paths for conducting a cooling fluid from the center region of the mold insert to edges of the mold insert; and
the method further comprises supplying the cooling fluid to the center region of the mold insert.
20. The method of claim 19 , wherein:
the mold insert is configured and the cooling fluid is supplied to maintain an isothermal condition at the recessed surface.