OPTOELECTRONIC SYSTEM
An embodiment of the invention discloses an optoelectronics system. The optoelectronic system includes an optoelectronic element having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface; a wavelength converting material covering a plurality of lateral surfaces; and a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.
1 . An optoelectronic system comprising:
an optoelectronic element, having a top surface, a bottom surface, a plurality of lateral surfaces arranged between the top surface and the bottom surface, and a first electrode arranged on the bottom surface;
a wavelength converting material, covering a plurality of lateral surfaces; and
a reflecting layer, formed on the wavelength converting material which is arranged on the top surface.
2 . The optoelectronic system of claim 1 , further comprising an adhesive arranged between the optoelectronic element and the reflecting layer.
3 . The optoelectronic system of claim 2 , wherein the adhesive comprises silicone.
4 . The optoelectronic system of claim 1 , wherein the wavelength converting material is arranged to surround the plurality of lateral surfaces.
5 . The optoelectronic system of claim 1 , wherein the wavelength converting material directly contacts the plurality of lateral surfaces.
6 . The optoelectronic system of claim 1 , wherein the wavelength converting material exposes the first electrode.
7 . The optoelectronic system of claim 1 , wherein the wavelength converting material comprises different kinds of phosphors.
8 . The optoelectronic system of claim 1 , wherein the reflecting layer is a sheet-like structure.
9 . The optoelectronic system of claim 1 , wherein the reflecting layer has a portion extending beyond at least one of the plurality of lateral surfaces.
10 . The optoelectronic system of claim 1 , further comprising a fan-out electrode electrically formed on the first electrode and arranged on the wavelength converting material.
11 . The optoelectronic system of claim 1 , wherein the wavelength converting material has a sidewall through which light emitted from the optoelectronic element is configured to escape from the optoelectronic system.
12 . The optoelectronic system of claim 1 , wherein the wavelength converting material comprises a first phosphor layer and a second phosphor layer overlapping the first phosphor layer.
13 . The optoelectronic system of claim 2 , wherein the adhesive and the reflecting layer are laterally coplanar with each other.
14 . The optoelectronic system of claim 1 , further comprising a substrate arranged on the reflecting layer.
15 . The optoelectronic system of claim 1 , wherein the optoelectronic element further comprises a second electrode arranged on the bottom surface.
16 . The optoelectronic system of claim 1 , further comprising a submount which the optoelectronic element is bonded to.