IP Library Patent Application 15657769
Patent Application
App. No. 15/657,769

HOUSING FOR A CIRCUIT THAT IS TO BE IMPLANTED IN-VIVO AND PROCESS OF MAKING THE SAME

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Quick Facts
Patent No.
US None
App. No.
15/657,769
Abstract

The present invention provides a biocompatible circuit assembly that includes a circuit encased within a housing. In some embodiments, the housing is a PMMA housing and before the circuit is enclosed within the housing the circuit is encased within a brick of epoxy.

Claims (16)

1 . A method for fully encasing a circuit within a polymer housing, comprising:

placing the circuit in a mold;

injecting a formulation comprising monomers and polymers into the mold; and

polymerizing the formulation.

2 . The method of claim 1 , further comprising the step of at least partially covering the circuit with an epoxy prior to placing the circuit in the mold, wherein a sufficient amount of epoxy is used to cover the circuit so that the resulting surface topology is substantially smooth.

3 . The method of claim 2 , wherein some or all of the epoxy comprises a light blocking pigment.

4 . The method of claim 3 , wherein the light blocking pigment is black.

5 . The method of claim 1 , wherein the polymerization step is performed in a pressure vessel where the pressure is increased to at least about 125 psi using inert gas.

6 . The method of claim 1 , wherein the monomers are MMA monomers.

7 . The method of claim 1 , wherein the polymers are pre-polymerized PMMA.

8 . The method of claim 7 , wherein the formulation comprises between 60% and 80% pre-polymerized PMMA by volume.

9 . The method of claim 1 , wherein the monomers are MMA monomers, and the polymers are pre-polymerized PMMA.

10 . The method of claim 1 , wherein the formulation comprises between 60% and 80% pre-polymerized PMMA by volume.

11 . The method of claim 10 , wherein the formulation comprises 70% pre-polymerized PMMA by volume and 30% un-reacted MMA monomer into which the 70% pre-polymerized PMMA has been dissolved.

12 . The method of claim 1 , wherein the formulation is injected into the mold so that the formulation surrounds the circuit.

13 . The method of claim 12 , wherein the formulation completely surrounds the circuit.

Assignments (5)
SECURITY INTEREST Recorded Sep 11, 2023
From: SENSEONICS, INCORPORATED
To: HERCULES CAPITAL, INC.
Reel/Frame 064866/0963 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2020
From: SOLAR CAPITAL LTD., AS AGENT
To: SENSEONICS, INCORPORATED
Reel/Frame 052207/0242 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 1, 2019
From: SENSEONICS, INCORPORATED
To: SOLAR CAPITAL LTD., AS AGENT
Reel/Frame 049926/0827 →
RELEASE OF SECURITY INTEREST Recorded Jul 25, 2019
From: OXFORD FINANCE LLC, AS COLLATERAL AGENT AND AS LENDER
To: SENSEONICS, INCORPORATED
Reel/Frame 049873/0713 →
SECURITY INTEREST Recorded Jan 26, 2018
From: SENSEONICS, INCORPORATED
To: OXFORD FINANCE LLC, AS COLLATERAL AGENT AND AS LENDER
Reel/Frame 045164/0154 →