Electronic device
According to one embodiment, an electronic device including a first substrate which includes a first basement, a first conductive layer, and a second conductive layer in contact with the first conductive layer, a second substrate which includes a second basement opposed to the first conductive layer and separated from the first conductive layer, a third conductive layer, and a first hole penetrating the second substrate, and a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole and directly contacts the second conductive layer.
1. An electronic device comprising:
a first substrate which comprises a first basement, a first conductive layer, and a second conductive layer in contact with the first conductive layer;
a second substrate which comprises a second basement opposed to the first conductive layer and separated from the first conductive layer, a third conductive layer, and a first hole penetrating the second substrate; and
a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole and directly contacts the second conductive layer, wherein
the second conductive layer comprises a second hole opposed to the first hole of the second substrate,
the connecting material electrically connects the first conductive layer and the third conductive layer via the first hole and the second hole,
the first conductive layer comprises a third hole led to the second hole, and
the first basement comprises a recess led to the third hole.
2. The electronic device according to Claim 1 , wherein
the connecting material contacts an inner surface of the second conductive layer in the second hole.
3. The electronic device according to claim 1 , wherein
the connecting material contacts an inner surface of the first conductive layer in the third hole.
4. The electronic device according to claim 1 , wherein
the connecting material contacts the recess.
5. The electronic device according to claim 4 , further comprising
an organic insulating layer which is located between the first basement and the second basement,
wherein the organic insulating layer comprises a fourth hole led to the first hole and the second hole, and covers the second conductive layer.
6. The electronic device according to claim 5 , wherein
the organic insulating layer comprises a first organic insulating layer provided in the first substrate, and
the fourth hole comprises a first portion penetrating the first organic insulating layer.
7. The electronic device according to claim 6 , wherein
the first organic insulating layer covers the first conductive layer and the second conductive layer.
8. The electronic device according to claim 7 , wherein
the first organic insulating layer is a seal which bonds the first substrate and the second substrate.
9. The electronic device according to claim 8 , wherein
the first conductive layer is located over the first basement, and
the second conductive layer is located over the first conductive layer, and is opposed to a second surface opposite to a first surface,
the third conductive layer of the second substrate is provided on the first surface.
10. The electronic device according to claim 9 , wherein
the first conductive layer comprises the third hole having a smaller diameter than the second hole,
an upper surface of the first conductive layer is exposed in the second hole, and
the connecting material contacts the upper surface of the first conductive layer.
11. The electronic device according to claim 1 , wherein
the second conductive layer comprises the second hole having a larger diameter than the first hole.
12. The electronic device according to claim 1 , wherein
a thickness of the second conductive layer is greater than a thickness of the first conductive layer.
13. The electronic device according to claim 1 , wherein
the second conductive layer comprises silver or an alloy containing silver.