Method of fabricating a semiconductor module with a inclined groove formed in resin side surface
A manufacturing method of a semiconductor module includes: sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate on the semiconductor chip, and multiple terminals, such that the resin includes a first surface, a second surface located opposite to the first surface, and a side surface, a groove extends in the side surface from the first surface to the second surface, an inner surface of the groove includes a first tapered surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes.
1. A manufacturing method of a semiconductor module comprising:
(a) sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate connected to the semiconductor chip, and multiple terminals connected to the semiconductor chip, such that
the resin after the assembly is sealed includes a first surface, a second surface located opposite to the first surface, and a side surface connecting the first surface to the second surface,
the multiple terminals projects from the side surface,
a groove is provided between the multiple terminals in the side surface in a manner as to extend from the first surface to the second surface,
an inner surface of the groove includes a first tapered surface inclining toward the first surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and
(b) cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes on the first surface.
2. The manufacturing method of the semiconductor module according to claim 1 , wherein
the side surface includes:
a third tapered surface inclining toward the first surface; and
a fourth tapered surface provided between the third tapered surface and the first surface, the fourth tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the third tapered surface, and
in the step of (b), the first surface is cut within an area located on the first surface side from a boundary between the third tapered surface and the fourth tapered surface.
3. The manufacturing method of the semiconductor module according to claim 2 , wherein
the third tapered surface and the fourth tapered surface are provided in portion of the side surface including outside of the groove.
4. A semiconductor module comprising:
an assembly including a semiconductor chip, a heat-dissipation plate disposed on a surface of the semiconductor chip, and multiple terminals connected to the semiconductor chip, and
resin provided such that the resign seals the assembly, the resin including a first surface in contact with the heat-dissipation plate, a second surface located opposite to the first surface, and side surfaces connecting the first surface to the second surface, wherein
the multiple terminals project from the side surface,
a groove is provided between the multiple terminals in the side surface such that the groove extends from the first surface to the second surface,
an inner surface of the groove includes a first tapered surface inclining toward the first surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface, and
the resin has an opening at which the heat-dissipation plate is exposed on the first surface, the opening being provided from an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface across the first surface.
5. The semiconductor module according to claim 4 , wherein
the side surface includes a third tapered surface inclining toward the first surface, and a fourth tapered surface provided between the third tapered surface and the first surface, the fourth tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the third tapered surface, and
the opening is provided within an area located on the first surface side from a boundary between the third tapered surface and the fourth tapered surface.
6. The semiconductor module according to claim 5 , wherein
the third tapered surface and the fourth tapered surface are provided in portions of the side surface including outside of the groove.