IP Library Granted Patent US 10,580,680
Granted Patent B2
US 10,580,680 · App. 15/660,307 · Granted Mar 3, 2020

Methods for masking a pin chuck, and articles made thereby

Inventors: Edward Gratrix (Monroe, CT); William Spitzmacher (Durham, CT); David Casale (Philadelphia, PA); Derek Rollins (Philadelphia, PA); Robert E. Klinger (Murrieta, CA)
H01L21/6838C23C14/042C23C14/0611C23C14/5806C23C14/588H01L21/6833
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Quick Facts
Patent No.
US 10,580,680
App. No.
15/660,307
Granted
Mar 3, 2020
Kind
B2
Abstract

A method for selectively coating the tops of pins of a pin chuck with a high thermal stability material, such as diamond-like carbon (DLC). Non-pin areas (“valleys”) of the pin chuck support surface are temporarily covered with glass frit or glass beads during the DLC coating operation. After coating, the glass frit/beads masking material may be removed, leaving the DLC material selectively coating the pin tops. The selective DLC coating avoids the cracking or warping problems due to CTE mismatch when DLC is coated over the entire pin chuck support surface, as the pin chuck material typically is very different from DLC.

Claims (16)

1. An article for supporting and clamping a component for processing, comprising:

a) a plurality of pins extending from a chuck support surface, each pin having a terminal end, where said terminal end of each pin collectively define a plane; and

b) at least one layer of a plurality of bodies each no larger than about 1000 microns covering said chuck support surface between pins, and not covering said terminal surface, wherein said plurality of bodies is in the form of beads.

2. In a chuck for supporting and clamping a component for processing, a method of selectively coating a terminal surface of substantially each of a plurality of pins extending from a support surface of said chuck, said method comprising:

(a) providing a chuck having a support surface populated with a plurality of pins;

(b) covering said chuck support surface other than said terminal surface of said pins, with at least one layer of a plurality of bodies;

(c) coating substantially all of said chuck support surface and terminal surfaces of pins that extends from said chuck support surface with diamond-like carbon; and

(d) removing said plurality of bodies from contact with said chuck support surface.

3. The method of claim 2 , wherein said plurality of bodies is in the form of a slurry including a binder.

4. The method of either of claim 3 , where the binder in the slurry is UV curable.

5. The method of claim 4 , further comprising selectively curing the binder of the mixture that is located on the upper surface of the pin chuck between pins, and not located on pin tops, and then removing uncured binder.

6. The method of claim 2 , wherein said plurality of bodies include glass, and are fused to form a frit.

7. The method of claim 2 , wherein said chuck is a vacuum chuck having a vacuum seal land, and further wherein said plurality of bodies is in the form of loose beads.

8. The method of claim 7 , wherein said vacuum seal land forms a wall to confine said loose beads.

9. A chuck for supporting and clamping a component for processing, comprising a plurality of pins extending from a chuck support surface, each pin having a terminal end coated with diamond-like carbon, further comprising a layer of a metal disposed on said diamond-like carbon coating, said metal having a thermal expansion coefficient not greater than about 6 ppm/K.

10. The chuck of claim 9 , wherein said metal comprises a nickel-iron alloy.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2022
From: M CUBED TECHNOLOGIES INC.
To: II-VI DELAWARE, INC.
Reel/Frame 060333/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: GRATRIX, EDWARD; KLINGER, ROBERT E.; SPITZMACHER, WILLIAM
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 052745/0248 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →