Electronic apparatus and manufacturing method of the same
View Patent ↗According to one embodiment, an electronic apparatus includes a first substrate including a first basement and a first conductive layer, a second substrate including a second basement, which is opposed to the first conductive layer and is separated from the first conductive layer, a second conductive layer, and a first hole penetrating the second basement, and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole.
1. An electronic apparatus comprising:
a first substrate comprising a first basement and a first conductive layer;
a second substrate comprising:
a second basement, which is opposed to the first conductive layer and is separated from the first conductive layer,
a second conductive layer, and
a first hole penetrating the second basement; and
a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole; and
an organic insulating layer located between the first conductive layer and the second basement,
wherein the first conductive layer includes a second hole opposed to the first hole, and
the organic insulating layer includes a third hole connected to the first hole and the second hole.
2. The electronic apparatus according to claim 1 , wherein:
the first conductive layer includes a first upper surface, and a first inner surface facing the second hole; and
the connecting material is in contact with the first upper surface and the first inner surface.
3. The electronic apparatus according to claim 1 , wherein the first basement includes a concavity opposed to the second hole.
4. The electronic apparatus according to claim 3 , wherein the connecting material is in contact with the concavity.
5. The electronic apparatus according to claim 1 , wherein:
the organic insulating layer comprises a first organic insulating layer provided in the first substrate, a seal which bonds the first substrate and the second substrate together, and a second organic insulating layer provided in the second substrate; and
the third hole includes a first portion penetrating the first organic insulating layer, a second portion penetrating the seal, and a third portion penetrating the second organic insulating layer.
6. The electronic apparatus according to claim 1 , wherein the first conductive layer includes a slit at a periphery of the second hole.
7. The electronic apparatus according to claim 5 , wherein:
the organic insulating layer includes a first organic insulating layer provided in the first substrate, a second organic insulating layer provided in the second substrate, and a seal which bonds the first substrate and the second substrate together;
the first substrate comprises a third conductive layer which is located between the first organic insulating layer and the seal, and is electrically connected to the first conductive layer; and
the third conductive layer includes a fourth hole connected to the third hole.