Solid-state image pickup device and manufacturing method thereof
View Patent ↗There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.
1. A solid-state image pickup device, comprising:
a functional region provided with an organic photoelectric conversion film over a light incident surface of a semiconductor substrate;
a plurality of bonding pads disposed in a peripheral region around the functional region;
a plurality of guard rings surrounding the plurality of bonding pads, wherein the guard rings are connected to the semiconductor substrate; and
a plurality of apertures facing the bonding pads,
wherein the plurality of guard rings includes a first guard ring that is disposed outside of the plurality of bonding pads and surrounds the plurality of bonding pads in a plan view and second guard rings that surround the plurality of bonding pads respectively in the plan view.
2. The solid-state image pickup device according to claim 1 , further comprising:
a plurality of pixels arranged in a matrix pattern within the functional region.
3. The solid-sate image pickup device according to claim 1 , wherein, in cross-section, the plurality of guard rings are disposed at least from the light incident surface of the semiconductor to a same layer as the organic film.
4. The solid-state image pickup device according to claim 3 , wherein first ends of the plurality of guard rings are connected to the semiconductor substrate.
5. The solid-state image pickup device according to claim 1 , wherein the plurality of guard rings include a plurality of layers.
6. The solid-state image pickup device according to claim 1 , wherein the plurality of guard rings are formed from a plurality of metallic layers.
7. The solid-state image pickup device according to claim 6 , wherein at least a first layer of the plurality of guard rings is a first metallic plug.
8. The solid-state image pickup device according to claim 7 , wherein at least a second layer of the plurality of guard rings is a first metallic wire.
9. The solid-state image pickup device according to claim 8 , wherein at least a third layer of the plurality of guard rings is a second metallic plug.
10. The solid-state image pickup device according to claim 9 , wherein at least a fourth layer of the plurality of guard rings is a second metallic wire.
11. The solid-state image pickup device according to claim 1 , further comprising:
a plurality of insulating films, wherein at least a portion of at least some of the insulating films are between the light incident surface of the semiconductor substrate and the organic film.
12. The solid-state image pickup device according to claim 11 , wherein at least a side surface of each of the insulating films between the light incident surface of the semiconductor substrate and the organic film are in contact with the plurality of the guard rings.
13. The solid-state image pickup device according to claim 11 , wherein the insulating films are each a silicon oxide film.
14. The solid-state image pickup device according to claim 12 , further comprising:
an upper electrode, wherein the upper electrode is on a light incident side of the organic film;
a lower electrode, wherein the lower electrode is between the organic film and the light incident surface of the semiconductor substrate.
15. The solid-state image pickup device according to claim 14 , wherein the upper electrode is a common electrode.
16. The solid-state image pickup device according to claim 15 , wherein the lower electrode is a pixel electrode.
17. The solid-state image pickup device according to claim 16 , wherein the organic film is an organic photoelectric conversion film.
18. The solid-state image pickup device according to claim 14 , further comprising:
a passivation film, wherein the passivation film covers a top surface of the functional region and a top surface of the plurality of guard rings.
19. The solid-state image pickup device according to claim 18 , wherein the passivation film is at least one of a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film.
20. The solid-state image pickup device according to claim 18 , wherein the passivation film is in contact with the top surface of the plurality of guard rings.
21. The solid-state image pickup device according to claim 18 , wherein the passivation film is in contact with the top surface of the plurality of guard rings and at least a portion of a side surface of the plurality of guard rings.
22. The solid-state image pickup device according to claim 18 , wherein the passivation film is in contact with the top surface of the plurality of guard rings, at least a portion of a first side surface of the plurality of guard rings, and at least a portion of a second side surface of the plurality of guard rings.
23. The solid-state image pickup device according to claim 18 , wherein the plurality of guard rings include a plurality of layers, and wherein the passivation film is in contact with the top surface of a top layer of the plurality of guard rings.
24. The solid-state image pickup device according to claim 23 , wherein the layers of the plurality of guard rings are metallic layers.
25. The solid-state image pickup device according to claim 23 , wherein the passivation film is in contact with at least one side surface of the top layer of the plurality of guard rings.
26. The solid-state image pickup device according to claim 24 , wherein the passivation film is not in contact with a layer of the plurality of guard rings other than the top layer.
27. The solid-state image pickup device according to claim 1 , wherein the plurality of guard rings include a plurality of layers, and wherein a top layer of the plurality of guard rings is at the same layer as the organic film.
28. The solid-state image pickup device according to claim 1 , wherein the functional region includes a plurality of pixels.
29. An electronic apparatus, comprising:
a solid-state image pickup device, including:
a functional region provided with an organic photoelectric conversion film over a light incident surface of a semiconductor substrate;
a plurality of bonding pads disposed in a peripheral region around the functional region;
a plurality of guard rings surrounding the plurality of bonding pads, wherein the guard rings are connected to the semiconductor substrate; and
a plurality of apertures facing the bonding pad,
wherein the plurality of guard rings includes a first guard ring that is disposed outside of the plurality of bonding pads and surrounds the plurality of bonding pads in a plan view and second guard rings that surround the plurality of bonding pads respectively in the plan view.