Fingerprint identification module

1. A fingerprint identification module, comprising:

a cover plate, having an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface;

a fingerprint identification sensor, located under the microstructures;

a first adhesive layer, wherein the fingerprint identification sensor is attached to the microstructures through the first adhesive layer, the first adhesive layer is adhered between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the other portion of the fingerprint identification sensor; and

at least one light source, located under the inner surface and adjacent to the fingerprint identification sensor.

2. The fingerprint identification module according to claim 1 , wherein the cover plate is a cover plate of a display apparatus disposed on the fingerprint identification module or a cover plate of a touch apparatus disposed on the fingerprint identification module.

3. The fingerprint identification module according to claim 1 , wherein the microstructures are hollow structures recessed in the inner surface.

4. The fingerprint identification module according to claim 1 , wherein the microstructures are prism structures or columnar structures protruding from the inner surface.

5. The fingerprint identification module according to claim 1 , wherein the microstructures and the cover plate are integrally formed.

6. The fingerprint identification module according to claim 1 , wherein the first adhesive layer includes a ring structure disposed between the microstructures and the fingerprint identification sensor, and the air gap is surrounded by the ring structure.

7. The fingerprint identification module according to claim 1 , further comprising:

a second adhesive layer, wherein the microstructures are attached to the inner surface of the cover plate through the second adhesive layer.

8. The fingerprint identification module according to claim 1 , further comprising:

a display element, located between the cover plate and the microstructures;

a second adhesive layer, wherein the microstructures are attached to the display element through the second adhesive layer; and

a third adhesive layer, wherein the display element is attached to the cover plate through the third adhesive layer.

9. The fingerprint identification module according to claim 8 , further comprising:

an optical element layer, located between the microstructures and the fingerprint identification sensor; and

a fourth adhesive layer, wherein the fingerprint identification sensor is attached to the optical element layer through the fourth adhesive layer, and the optical element layer, the fourth adhesive layer, and the fingerprint identification sensor are attached to the microstructures through the first adhesive layer.

10. The fingerprint identification module according to claim 9 , wherein the optical element layer includes a pinhole array element, a fiber array element, an anti-spy film, a light diffraction element, or a polarizer.

11. A fingerprint identification module, comprising:

a cover plate, having an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface;

a fingerprint identification sensor, located under the microstructures;

an optical element layer, located between the microstructures and the fingerprint identification sensor;

a first adhesive layer, wherein the optical element layer is attached to the microstructures through the first adhesive layer;

a second adhesive layer, wherein the fingerprint identification sensor is attached to the optical element layer through the second adhesive layer; and

at least one light source, located under the inner surface and adjacent to the fingerprint identification sensor.

12. The fingerprint identification module according to claim 11 , wherein the optical element layer includes a pinhole array element, a fiber array element, an anti-spy film, a light diffraction element, or a polarizer.

13. The fingerprint identification module according to claim 11 , wherein the first adhesive layer is located between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the optical element layer located on the other portion of the fingerprint identification sensor.

14. The fingerprint identification module according to claim 11 , wherein the fingerprint identification sensor is comprehensively covered by the first adhesive layer, and a refractive index of the first adhesive layer is less than a refractive index of each of the microstructures.

15. The fingerprint identification module according to claim 11 , wherein the optical element layer includes a plurality of light guide elements, and the at least one light source is located between the light guide elements, wherein the fingerprint identification module further comprising:

a plurality of the fingerprint identification sensors, attached to the light guide elements through the second adhesive layer, respectively.

16. The fingerprint identification module according to claim 15 , wherein each of the light guide elements includes an inclined surface tilted relative to the cover plate, and the inclined surface of each of the light guide elements is adjacent to the at least one light source.

17. The fingerprint identification module according to claim 11 , wherein the optical element layer includes a plurality of microstructures, and a pitch of the microstructures of the optical element layer is smaller than a pitch of the microstructures located at the inner surface.

18. The fingerprint identification module according to claim 17 , wherein the microstructures of the optical element layer and the microstructures located at the inner surface are columnar structures or columnar recesses.