Insulated packaging and method of making same
View Patent ↗Insulated packaging is provided including an inner substrate and an outer substrate attached to the inner substrate to form an air gap therebetween. An expandable material including expandable microspheres is provided with the expandable material disposed between the inner substrate and the outer substrate. An adhesive material different than the expandable material is disposed between the inner substrate and the outer substrate to attach the inner substrate to the outer substrate. A method for forming the insulated packaging is also provided.
1. A method of making insulated packaging, the method comprising:
applying a thermally expandable material to at least one of a first substrate and a second substrate for being disposed therebetween, the expandable material comprising microspheres;
applying an adhesive material different than the expandable material to at least one of the first substrate and the second substrate for being disposed therebetween at locations where the adhesive material does not overlap the thermally expandable material;
attaching the first substrate to the second substrate with the adhesive material therebetween; and
expanding the expandable material by expanding the microspheres thereof.
2. The method of claim 1 wherein the first substrate and the second substrate are comprised of paper stock material.
3. The method of claim 2 including providing the first and second substrates in roll or web form.
4. The method of claim 3 wherein the paper stock is flexible for being provided in roll or web form.
5. The method of claim 2 wherein the paper stock material of the first substrate is different from the paper stock material of the second substrate.
6. The method of claim 1 wherein applying the adhesive material comprises applying the adhesive material to the at least one of the first substrate and the second substrate in at least two sections such that at least a portion of the thermally expandable material is positioned between the two sections of adhesive material on the at least one of the first substrate and the second substrate.
7. The method of claim 6 wherein applying the adhesive material in at least two sections includes applying the adhesive material in two substantially linear sections with at least a portion of the thermally expandable material positioned between the two substantially linear sections of adhesive material.
8. The method of claim 1 wherein the expandable material is applied before forming of the insulated packaging.
9. The method of claim 1 wherein the expandable material is applied during forming of the insulated packaging.
10. The method of claim 1 wherein the expandable material is expanded during forming of the insulated packaging.
11. The method of claim 1 wherein the expandable material is expanded after forming of the insulated packaging.
12. The method of claim 1 wherein the expandable material engages both the first substrate and the second substrate, and the expandable microspheres have an activation temperature not exceeding 190° F.
13. The method of claim 1 wherein the adhesive material is a hot melt adhesive.
14. The method of claim 1 further comprising forming an insulated bag using the attached first and second substrates having the expandable material and the different adhesive material therebetween.
15. The method of claim 1 including feeding the first and second substrates into a conveyor-type machine system in which the thermally expandable material is applied to the at least one of the first substrate and the second substrate.
16. The method of claim 1 wherein after the expandable material is expanded, non-ruptured, expanded microspheres are disposed between the attached first and second substrates.
17. The method of claim 1 wherein attaching the first substrate to the second substrate with the adhesive material comprises engaging both the first substrate and the second substrate with the adhesive material.
18. The method of claim 1 wherein the first substrate comprises one or more of paperboard, paper, foil, film, fabric, foam, and plastic and the second substrate comprises one or more of paperboard, paper, foil, film, fabric, foam, and plastic.
19. The method of claim 1 wherein applying the adhesive material at locations where the adhesive material does not overlap the thermally expandable material includes applying at least a portion of the adhesive material to a location spaced apart from the thermally expandable material.