Method for manufacturing multilayer film-deposited substrate and multilayer film-deposited substrate
A method for manufacturing a multilayer film-deposited substrate includes stacking a plurality of lamination units on the substrate while rotating the substrate around a rotational axis perpendicular to a substrate surface. Each of the lamination units has a plurality of layers formed by a dry deposition process. When a plurality of the multilayer film-deposited substrates are manufactured by the dry deposition process, a deposition is performed in a condition satisfying at least one of the following requirements (1) and (2), with estimating a change with time in a deposition rate: [T depo-unit /T r <(m−0.02) or (m+0.02)<T depo-unit /T r ] (1), and [(n−0.02)≤T i /T r ≤(n+0.02)] (2). m and n are independently any integer. T i is a time interval between the depositions among each layer of the plurality of layers. T depo-unit is a deposition unit time required for depositing the one lamination unit. T r is a rotation period of the substrate.
1. A method for manufacturing a multilayer film-deposited substrate comprising a substrate and a multilayer film containing a plurality of lamination units and provided on the substrate, the method comprising:
stacking the plurality of lamination units on the substrate while rotating the substrate around a rotational axis perpendicular to a substrate surface thereof, in which each of the lamination units has a plurality of layers formed by a dry deposition process, wherein:
when a plurality of the multilayer film-deposited substrates are manufactured by using the dry deposition process, a deposition is performed only under a condition satisfying at least one of the following requirements (1) and (2), thereby obtaining the multilayer film-deposited substrate having an in-plane distribution in a total film thickness of the multilayer film of 0.2% or less:
T depo-unit /T r <( m− 0.02) or ( m+ 0.02)< T depo-unit /T r (1)
( n− 0.02)≤ T i /T r ≤( n+ 0.02) (2)
where
m and n are independently any integer,
T i is a time interval between the depositions among each layer of the plurality of layers included in the lamination unit,
T depo-unit (=T depo-total +T i-total ) is a deposition unit time required for depositing the one lamination unit, where T depo-total is a total deposition time of the plurality of layers included in the lamination unit and T i-total is a total of the time intervals T i 's, and
T r is a rotation period of the substrate.
2. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the multilayer film-deposited substrate has an in-plane distribution in a total film thickness of the multilayer film being 0.14% or less.
3. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the multilayer film is a multilayer reflective film obtained by stacking a plurality of the lamination units, wherein each of the lamination units has a high refractive layer-low refractive layer structure, or each of the lamination units has a low refractive layer-high refractive layer structure.
4. The method for manufacturing the multilayer film-deposited substrate according to claim 3 , wherein the multilayer reflective film has an in-plane distribution of a centroid wavelength of an EUV reflected light being 0.030 nm or less.
5. The method for manufacturing the multilayer film-deposited substrate according to claim 3 , further comprising forming a protective layer for the multilayer reflective film on the multilayer reflective film.
6. The method for manufacturing the multilayer film-deposited substrate according to claim 3 , further comprising forming an absorption layer that absorbs an EUV light, on the multilayer reflective film or on a protective layer for the multilayer reflective film.
7. The method for manufacturing the multilayer film-deposited substrate according to claim 6 , further comprising forming a low reflection layer having a low reflection with regard to an inspection light for use in an inspection of a mask pattern, on the absorption layer.
8. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the deposition is performed in a condition satisfying the requirement (2).
9. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the time interval T i between the depositions among the each layer is controlled to satisfy at least one of the requirements (1) and (2).
10. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the rotation period of the substrate T r is controlled to satisfy at least one of the requirements (1) and (2).
11. The method for manufacturing the multilayer film-deposited substrate according to claim 1 , wherein the deposition unit time T depo-unit required for depositing the one lamination unit is controlled to satisfy the requirement (1).