Method of manufacturing a light emitting device
View Patent ↗A method of manufacturing of a Light Emitting Device that has increased reliability and efficiency. Specifically, the disclosed methods uses Atomic Layer Deposition to improve the thermal conductivity between the ceramic plate and the LED, decrease the amount of organic contamination, and increase the efficiency of the optical output of the Light Emitting Device.
1. A method of manufacturing a light emitting device comprising:
applying an adhesive to a portion of a ceramic phosphor plate, wherein the portion of the ceramic phosphor plate has a smaller surface area than a surface area of the ceramic phosphor plate;
forming a gap between a light emitting diode and the ceramic phosphor plate by affixing the ceramic phosphor plate to the light emitting diode using the adhesive applied to the portion of the ceramic phosphor plate; and
filling the gap with a transparent material by atomic layer deposition.
2. The method of claim 1 , further comprising:
coating sidewalls of the light emitting diode with the transparent material by atomic layer deposition.
3. The method of claim 1 , wherein the adhesive is silicone or sol-gel glue.
4. The method of claim 1 , wherein the adhesive is a low melting point glass.
5. The method of claim 1 , wherein the transparent material has a same index of refraction as the light emitting diode.
6. The method of claim 1 , wherein the transparent material is Alumina or Al 2 O 3 .
7. The method of claim 1 , wherein the portion of the ceramic plate includes a plurality of discrete regions.
8. The method of claim 1 , wherein the portion of the ceramic plate has a cross-sectional area in a shape of a cross.
9. The method of manufacturing according to claim 1 , wherein the portion of the ceramic plate has a cross-sectional area substantially in a shape of a line.
10. The method of manufacturing according to claim 1 , wherein the ceramic phosphor plate is Lumiramic.
11. A method of manufacturing a light emitting device comprising:
applying an adhesive to a portion of a light emitting diode, wherein the portion of the light emitting diode has a smaller surface area than a surface area of the light emitting diode;
forming a gap between the light emitting diode and a ceramic phosphor plate by affixing the ceramic phosphor plate to the light emitting diode using the adhesive applied to the portion of the light emitting diode; and
filling the gap with a transparent material by atomic layer deposition.
12. The method of manufacturing according to claim 11 , further comprising:
coating sidewalls of the light emitting diode with the transparent material by atomic layer deposition.
13. The method of claim 1 , wherein the adhesive is silicone or sol-gel glue.
14. The method of claim 11 , wherein the adhesive is a low melting point glass.
15. The method of claim 11 , wherein the transparent material has a same index of refraction as the light emitting diode.
16. The method of claim 11 , wherein the transparent material is Alumina or Al 2 O 3 .
17. The method of claim 11 , wherein the portion of the light emitting diode includes a plurality of discrete regions.
18. The method of claim 11 , wherein the portion of the light emitting diode has a cross-sectional area in a shape of a cross.
19. The method of claim 11 , wherein the portion of the light emitting diode has a cross-sectional area in a shape of a line.
20. The method of claim 11 , wherein the ceramic plate is Lumiramic.