Polyamic acid resin, polyamideimide film, and method for preparing the same
Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, a polyamideimide film capable of implementing high modulus and excellent optical properties while implementing excellent mechanical properties, heat properties, and electrical properties, and a method for preparing the same.
1. A polyamideimide film comprising:
a polyamideimide resin derived from an aromatic diamine including:
2,2′-bis(trifluoromethyl)benzidine;
a cycloaliphatic dianhydride; and
an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC).
2. The polyamideimide film of claim 1 , wherein the cycloaliphatic dianhydride is cyclobutane tetracarboxylic dianhydride.
3. The polyamideimide film of claim 1 , wherein a content of the aromatic diacid dichloride ranges from 40 moles to 90 moles based on 100 moles of the aromatic diamine.
4. The polyamideimide film of claim 1 , wherein the polyamideimide film has a light transmittance, measured at 550 nm, of 88% or more, and a Yellow index of 3.0 or less.
5. The polyamideimide film of claim 4 , wherein the polyamideimide film has a modulus of 5.0 GPa or more, measured at an extension rate of 25 mm/min using UTM 3365 manufactured by Instron.
6. The polyamideimide film of claim 1 , wherein the polyamideimide film has a light transmittance, measured at 550 nm, of 88% or more, and a Yellow index of 3.0 or less, based on a thickness of 45 to 55 μm.
7. The polyamideimide film of claim 6 , wherein the polyamideimide film has a modulus of 5.0 GPa or more, measured at an extension rate of 25 mm/min using UTM 3365 manufactured by Instron, on a specimen having a thickness of 45 to 55 μm, a length of 50 mm, and a width of 10 mm.
8. A method for preparing a polyamideimide film comprising:
(a) preparing a polyamic acid solution by dissolving aromatic diamine containing 2,2′-bis(trifluoromethyl)benzidine in an organic solvent, and adding and reacting cycloaliphatic dianhydride and an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC);
(b) preparing polyamideimide resin by imidization of the polyamic acid solution; and
(c) applying a polyamideimide solution in which the polyamideimide resin is dissolved in the organic solvent.
9. The method of claim 8 , wherein the cycloaliphatic dianhydride is cyclobutane tetracarboxylic dianhydride.
10. The method of claim 8 , wherein in step (b), the polyamic acid solution further includes any one or two or more selected from an imidization catalyst and a dehydrating agent.
11. The method of claim 8 , wherein the polyamic acid solution in step (a) has a solid content of 3 to 20 wt %.
12. A polyamic acid resin derived from aromatic diamine including 2,2′-bis(trifluoromethyl)benzidine, a cycloaliphatic dianhydride, and an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC).
13. The polyamideimide film of claim 1 , wherein a molar ratio between the isophthaloyl dichloride (IPC) and the terephthaloyl dichloride (TPC) ranges from 0.3 to 4.0.
14. The method of claim 8 , wherein a molar ratio between the isophthaloyl dichloride (IPC) and the terephthaloyl dichloride (TPC) ranges from 0.3 to 4.0.
15. The polyamic acid resin of claim 12 , wherein a molar ratio between the isophthaloyl dichloride (IPC) and the terephthaloyl dichloride (TPC) ranges from 0.3 to 4.0.