Camera system
A camera system including an objective, an objective holder carrying the objective, an image sensor and a printed circuit board. The printed circuit board and the image sensor are connected to one another in an electronically conductive manner, and the image sensor and the objective are arranged such that an image is n focus on the image sensor. The printed circuit board has a circuit layer made of an electrically insulating material and a printed circuit board substrate, wherein the printed circuit board substrate is manufactured from a material with a coefficient of thermal expansion aL which deviates by no more than 30% from the coefficient of thermal expansion of a material from which the objective holder is manufactured.
1. A camera system for measurement applications, the camera system comprising:
an objective with at least one objective lens;
an objective holder that carries the objective;
an image sensor; and
a printed circuit board,
wherein the printed circuit board and the image sensor are connected to one another in an electronically conductive manner,
wherein the image sensor and the objective are arranged such that an image that is projected onto the image sensor by way of the objective in focus, and
wherein:
the objective holder is made of a material having a coefficients of thermal expansion a O ; and
the printed circuit board or a printed circuit board substrate of the printed circuit board are manufactured from a material with a coefficient of thermal expansion a L , wherein the coefficient of thermal expansion a O of the material the object holder is made of and the coefficient of thermal expansion a L of the material the printed circuit board or a printed circuit board substrate is made of differ from each other by no more than 30%.
2. The camera system according to claim 1 , wherein the printed circuit board is manufactured as an FR4 board with a coefficient of thermal expansion in the xy-plane in the region of a L =12*10 −6 /K to 14*10 −6 /K and the objective holder is produced from a stainless steel, the coefficient of thermal expansion of which likewise lies in the region of a O =10*10 −6 /K to 16*10 −6 /K.
3. The camera system according to claim 1 , wherein at least one circuit layer is arranged on the printed circuit board substrate,
wherein the circuit layer is produced from electrically insulating material and provided with predetermined circuits of the printed circuit board.
4. A camera system according to claim 3 , wherein the printed circuit board substrate and the objective holder are manufactured from the same material.
5. The camera system according to claim 1 , wherein the objective is manufactured from a material with a coefficient of thermal expansion a objective material ,
the at least one objective lens is made of a material having a coefficient of thermal expansion a objective material ,
wherein the coefficient of thermal expansion a objective material and the coefficient of thermal expansion a L differ from each other by no more than 30%.
6. The camera system according to claim 1 , wherein the printed circuit board substrate is manufactured from a material having a coefficient of thermal expansion a L ,
the image sensor is made of a material having a coefficient of thermal expansion a image sensor material , wherein
coefficient of thermal expansion a L and the coefficient of thermal expansion a image sensor material differ from each other by no more than 30%.
7. The camera system according to claim 1 , wherein the objective is adhesively bonded into a reception opening of the objective holder.
8. The camera system according to claim 1 , wherein adhesive connections in the camera system are embodied as thermally stable adhesive bonds, wherein the coefficient of thermal expansion a K of the employed adhesive in the adhesive connections and the thermal coefficients of the materials the components to be connected are made of, differ from each other by no more than 30%.
9. The camera system according to claim 8 , wherein the employed adhesive has a coefficient of thermal expansion in the region of a k =22*10 −6 /K to 25*10 −6 /K.
10. The camera system according to claim 1 , wherein the printed circuit board substrate has at least one circuit layer on its side that faces the image sensor and has at least one additional circuit layer on its side that faces away from the image sensor.
11. The camera system according to claim 1 , wherein the objective holder has attachment recesses for receiving connecting elements and is provided with positioning flanges in the region of the attachment recesses, said positioning flanges projecting in a direction in which the printed circuit board is assembled, and wherein the attachment openings in the printed circuit board are configured in such a way that they receive the positioning flanges.
12. The camera system according to claim 11 , wherein in an assembled state:
the positioning flanges of the objective holder are received in the attachment openings of the printed circuit board with a press fit, or
the positioning flanges of the objective holder are adhesively bonded into the attachment openings of the printed circuit board.
13. The camera system according to claim 1 , wherein the objective holder and the printed circuit board substrate each have threads so as to engage with each other, or
the objective holder and the printed circuit board substrate are welded, soldered or adhesively bonded to one another.
14. The camera system according to claim 1 , wherein the objective holder and the printed circuit board substrate have an integral embodiment.
15. The camera system according to claim 3 , wherein the image sensor is mounted on the printed circuit board substrate in a floating fashion, such that it is securely connected to the printed circuit board substrate by means of at most three hard adhesive spots.
16. The camera system according to claim 5 , wherein the coefficient of thermal expansion a objective material , of the objective and the coefficient of thermal expansion a O of the objective holder differ from each other by no more than 30%.