IP Library Granted Patent US 10,338,987
Granted Patent B2
US 10,338,987 · App. 15/670,377 · Granted Jul 2, 2019

Testing module compatibility

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,338,987
App. No.
15/670,377
Granted
Jul 2, 2019
Kind
B2
Abstract

A module is tested for compatibility with a chassis without being inserted into the chassis. A platform specification and chassis configuration is obtained. Information about the module is received from an NFC tag attached to the module. The information about the module is analyzed against the platform specification and chassis configuration. Based on the analysis, one of a set of conditions is determined to exist. A first condition exists when the module will not be supported according to the platform specification. A second condition exists when the module will be supported and there are no empty slots for which the module will be compatible with the chassis configuration. A third condition exists when the module will be supported and there is at least one empty slot for which the module will be compatible with the chassis configuration. An indication, perceptible to a user, of a determined condition is generated.

Claims (67)

1. A method for checking support and compatibility of a module without inserting the module into one of one or more empty slots of a chassis comprising:

obtaining a platform specification and a configuration of the chassis;

receiving information about the module from a Near Field Communication (NFC) tag coupled to the module;

analyzing the information about the module against the platform specification, and the chassis configuration;

based on the analysis, determining that one of a plurality of conditions exists, wherein the plurality of conditions comprise:

a first condition exists when the module will not be supported according to the platform specification;

a second condition exists when the module will be supported according to the platform specification and there are no empty slots for which the module will be compatible with the chassis configuration; and

a third condition exists when the module will be supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration; and

generating an indication, perceptible to a user, of a determined condition to allow the user to decide whether to insert the module.

2. The method of claim 1 comprising when the first condition exists,

not activating beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activating another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is not supported according to the platform specification.

3. The method of claim 1 comprising when the second condition exists,

not activating beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activating another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is supported according to the platform specification, but there are no empty slots for which the module will be compatible with the chassis configuration.

4. The method of claim 1 comprising when the third condition exists,

activating each beacon light emitting diode (LED) adjacent to each of the respective one or more empty slots for which the module will be compatible with the chassis configuration; and

activating another LED, separate from the beacon LED, wherein the activated other LED indicates that the module is supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration.

5. The method of claim 1 wherein the platform specification comprises a listing of modules that are supported by a vendor of the chassis.

6. The method of claim 1 wherein during the analyzing the module information, the module is external to the chassis.

7. A system for checking support and compatibility of a module while the module remains external to the chassis, the system comprising:

a processor-based system executed on a computer system comprising a processor, wherein the processor is configured to:

obtain a platform specification and a configuration for the chassis;

receive information about the module from a Near Field Communication (NFC) tag coupled to the module;

analyze the information about the module against the platform specification, and the chassis configuration;

based on the analysis, determine that one of a plurality of conditions exists, wherein the plurality of conditions comprise:

a first condition exists when the module will not be supported according to the platform specification;

a second condition exists when the module will be supported according to the platform specification and there are no empty slots of the chassis for which the module will be compatible with the chassis configuration; and

a third condition exists when the module will be supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration; and

generate an indication, perceptible to a user, of a determined condition to allow the user to decide whether to insert the module.

8. The system of claim 7 wherein the processor is configured to:

when the first condition exists,

not activate beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activate another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is not supported according to the platform specification.

9. The system of claim 7 wherein the processor is configured to:

when the second condition exists,

not activate beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activate another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is supported according to the platform specification, but there are no empty slots for which the module will be compatible with the chassis configuration.

10. The system of claim 7 wherein the processor is configured to:

when the third condition exists,

activate each beacon light emitting diode (LED) adjacent to each of the respective one or more empty slots for which the module will be compatible with the chassis configuration; and

activate another LED, separate from the beacon LED, wherein the activated other LED indicates that the module is supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration.

11. The system of claim 7 wherein the chassis configuration comprises user-configurable hardware and software options for the chassis.

12. The system of claim 7 wherein during the analysis, the module is outside of the chassis.

13. A computer program product, comprising a non-transitory computer-readable medium having a computer-readable program code embodied therein, the computer-readable program code adapted to be executed by one or more processors to implement a method for checking support and compatibility of a module while the module remains outside of a chassis, the method comprising:

obtaining a platform specification and a configuration of the chassis;

receiving information about the module from a Near Field Communication (NFC) tag coupled to the module;

analyzing the information about the module against the platform specification, and the chassis configuration;

based on the analysis, determining that one of a plurality of conditions exists, wherein the plurality of conditions comprise:

a first condition exists when the module will not be supported according to the platform specification;

a second condition exists when the module will be supported according to the platform specification and there are no empty slots of the chassis for which the module will be compatible with the chassis configuration; and

a third condition exists when the module will be supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration; and

generating an indication, perceptible to a user, of a determined condition to allow the user to decide whether to insert the module.

14. The computer program product of claim 13 wherein the method comprises:

when the first condition exists,

not activating beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activating another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is not supported according to the platform specification.

15. The computer program product of claim 13 wherein the method comprises:

when the second condition exists,

not activating beacon light emitting diodes (LEDs) adjacent to the empty slots of the chassis; and

activating another LED, separate from the beacon LEDs, wherein the activated other LED indicates that the module is supported according to the platform specification, but there are no empty slots for which the module will be compatible with the chassis configuration.

16. The computer program product of claim 13 wherein the method comprises:

when the third condition exists,

activating each beacon light emitting diode (LED) adjacent to each of the respective one or more empty slots for which the module will be compatible with the chassis configuration; and

activating another LED, separate from the beacon LED, wherein the activated other LED indicates that the module is supported according to the platform specification and there is at least one empty slot for which the module will be compatible with the chassis configuration.

17. The computer program product of claim 13 wherein the platform specification comprises a set of restrictions provided by a vendor of the chassis, and the chassis configuration comprises a set of restrictions configured by a customer of the vendor.

18. The computer program product of claim 13 wherein during the analyzing, the module does not occupy any slot of the chassis.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (044535/0109) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0414 →
RELEASE OF SECURITY INTEREST AT REEL 044535 FRAME 0001 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058298/0475 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 044535/0109 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 044535/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2017
From: SAWAL, VINAY; SAKTHIVEL, MARIMUTHU; WHITE, JOSEPH LASALLE
To: DELL PRODUCTS LP
Reel/Frame 043218/0714 →