High reliability housing for a semiconductor package
Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.
1. A method of making a semiconductor package, the method comprising:
providing a substrate;
coupling one or more die to the substrate;
electrically coupling the one or more die to the substrate using one or more connectors;
encapsulating one of the one or more connectors and at least a portion of one of the one or more die using a mold compound;
coupling an additional die to one of the one or more die after encapsulating at least a portion of the one of the one or more die;
electrically coupling the additional die to the substrate with one or more connectors;
coupling a glass lid to the additional die using an adhesive; and
simultaneously coupling a housing to the substrate at a bottom opening of the housing and over the glass lid at a top opening of the housing using an adhesive.
2. The method of claim 1 , wherein the substrate is a ball grid array substrate.
3. The method of claim 1 , wherein the housing is made of an opaque material.
4. The method of claim 1 , wherein the housing is formed through one of injection molding, transfer molding and any combination thereof.
5. The method of claim 1 , wherein a plurality of ball mounts is coupled to a second side of the substrate opposing a side of the substrate coupled to the die.
6. The method of claim 1 , further comprising coupling one or more lenses to the housing in an optical path of the glass lid.
7. A method of making a semiconductor package, the method comprising:
providing a substrate;
coupling a first die to the substrate;
electrically coupling the first die to the substrate using one or more connectors;
encapsulating one of the one or more connectors and at least a portion of the first die using a mold compound;
coupling a second die to the first die after encapsulating at least a portion of the first die;
electrically coupling the second die to the substrate with one or more connectors;
coupling a glass lid to the second die using an adhesive; and
simultaneously coupling a housing to the substrate at a bottom opening of the housing and over the glass lid at a top opening of the housing using an adhesive.
8. The method of claim 7 , wherein the substrate is a ball grid array substrate.
9. The method of claim 7 , wherein the housing is made of an opaque material.
10. The method of claim 7 , wherein the housing is formed through one of injection molding, transfer molding and any combination thereof.
11. The method of claim 7 , wherein a plurality of ball mounts is coupled to a second side of the substrate opposing a side of the substrate coupled to the die.
12. The method of claim 7 , further comprising coupling one or more lenses to the housing in an optical path of the glass lid.
13. A method of making a semiconductor package, the method comprising:
providing a substrate;
coupling a first die to the substrate;
electrically coupling the first die to the substrate using one or more connectors;
encapsulating one of the one or more connectors and at least a portion of the first die using a mold compound;
coupling a second die over the first die after encapsulating at least a portion of the first die;
electrically coupling the second die to the substrate with one or more connectors;
coupling a glass lid to the second die using an adhesive; and
simultaneously coupling a housing to the substrate at a bottom opening of the housing and over the glass lid at a top opening of the housing using an adhesive.
14. The method of claim 13 , wherein the substrate is a ball grid array substrate.
15. The method of claim 13 , wherein the housing is made of an opaque material.
16. The method of claim 13 , wherein the housing is formed through one of injection molding, transfer molding and any combination thereof.
17. The method of claim 13 , wherein a plurality of ball mounts is coupled to a second side of the substrate opposing a side of the substrate coupled to the die.
18. The method of claim 13 , further comprising coupling one or more lenses to the housing in an optical path of the glass lid.