IP Library Granted Patent US 11,110,285
Granted Patent B2
US 11,110,285 · App. 15/680,124 · Granted Sep 7, 2021

Electrical feedthrough with a sintered electrical connection

Inventors: Ulrich Hausch (Frankfurt, DE); Michael Schäfer (Künzell, DE); Jens Nachreiner (Schlüchtern, DE)
Assignee: Heraeus Deutschland GmbH & Co. KG
A61N1/3754A61B5/318A61N1/37512H02G15/013
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Quick Facts
Patent No.
US 11,110,285
App. No.
15/680,124
Granted
Sep 7, 2021
Kind
B2
Abstract

One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.

Claims (23)

1. An apparatus comprising a first frame, a further frame, a first element, a second element and a third element;

wherein

a) the first frame frames the further frame;

b) the further frame

i) frames the first element, and

ii) electrically insulates the first element and the first frame from each other;

c) the first element is electrically conductive;

d) the second element is electrically conductive;

e) the third element

i) provides an electrically conductive connection between the first element and the second element, and

ii) has a porosity in the range of 0.13 to 0.2;

iii) comprises Ag in an amount in the range of 10 to 100 wt. % based on the weight of the third element; and

iv) has a layer thickness in the range of 0.2 to 0.6 mm.

2. The apparatus of claim 1 , wherein the first element comprises a cermet.

3. The apparatus of claim 1 , wherein the further frame comprises a ceramic.

4. The apparatus of claim 1 , wherein the further frame and the first element are configured in one piece.

5. The apparatus of claim 1 , wherein the second element is selected from the group composed of an electrical contact, a conductive path, a wire, a socket, and a plug, or a combination of at least two of these devices.

6. The apparatus of claim 1 , wherein the apparatus further comprises an electrotechnical filter and wherein the first element or the second element or both is connected to the electrotechnical filter.

7. The apparatus of claim 1 , wherein the third element has a porosity in the range of 0.13 to 0.16.

8. An implantable electrical medical device comprising a housing and the apparatus of claim 1 ;

wherein the housing comprises a housing opening;

wherein the first frame has been fitted into the housing opening.

9. A method for producing an implantable electrical medical device comprising a housing comprising a housing opening, wherein the method comprises a method step of inserting the apparatus of claim 1 into the housing opening such that the housing opening contains the first frame.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2024
From: HERAEUS DEUTSCHLAND GMBH & CO. KG
To: HERAEUS MEDEVIO GMBH & CO. KG
Reel/Frame 068189/0526 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2017
From: HAUSCH, ULRICH; SCHÄFER, MICHAEL; NACHREINER, JENS
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 043858/0039 →
Priority Claims (1)
EP 16184554 · Aug 17, 2016 · regional
Continuity (1)
Related Publication 20180050211A1 · Feb 22, 2018
Cited By (2)
US 12,344,566 US 12,679,783