Compact printed circuit board assembly with insulating endcap via
A compact printed circuit board assembly includes a printed circuit board (PCB) and a preamplifier subassembly. The preamplifier subassembly includes a preamplifier and an insulating endcap abutting one another and arranged in a plane parallel to the PCB. An electrical via formed within the first insulating endcap provides an electrical connection between a decoupling capacitor and the PCB to reduce noise detectable in current flowing between the preamplifier and a current source.
1. A printed circuit board assembly comprising:
a printed circuit board (PCB);
a preamplifier subassembly electrically coupled to the PCB and further coupled to a read or write head, the preamplifier subassembly including:
a preamplifier with a first surface abutting a first insulating endcap, the preamplifier and the first insulating endcap arranged in a first plane parallel to a primary plane of the PCB; and
an electrical via formed within the first insulating endcap and providing an electrical connection between a first decoupling capacitor and at least one of the PCB and the preamplifier to reduce noise detectable in current flowing between the preamplifier and a current source.
2. The printed circuit board assembly of claim 1 , wherein the preamplifier subassembly includes at least two preamplifiers arranged in the first plane and positioned in contact with opposing surfaces of the first insulating endcap.
3. The printed circuit board assembly of claim 1 , wherein the first decoupling capacitor is arranged in a second plane parallel to the PCB and the first plane, the first decoupling capacitor aligned with the first insulating endcap and the PCB along an axis perpendicular to the first plane.
4. The printed circuit board assembly of claim 3 , wherein the first insulating endcap abuts a first surface of the preamplifier and a second insulating endcap abuts a second opposite surface of the preamplifier, the second insulating endcap including an electrical via coupling the PCB to a second decoupling capacitor arranged in the second plane.
5. The printed circuit board assembly of claim 4 , wherein the first decoupling capacitor and the second decoupling capacitor are arranged in a second plane parallel to the first plane and the PCB.
6. The printed circuit board assembly of claim 1 , wherein the first decoupling capacitor couples to the preamplifier through a redistribution layer.
7. The printed circuit board assembly of claim 1 , wherein the PCB and the preamplifier subassembly are coupled to one another and positioned on an actuator arm and the first decoupling capacitor reduces noise between the preamplifier and at least one read or write head.
8. The printed circuit board assembly of claim 1 , wherein the first insulating endcap separates the first decoupling capacitor from underlying electrical connections formed on the PCB.
9. A method comprising:
attaching a printed circuit board (PCB) to a preamplifier subassembly including a preamplifier abutting a first insulating endcap, the first insulating endcap including an electrical via providing an electrical connection between a first decoupling capacitor and at least one of the PCB and the preamplifier to reduce noise detectable in current flowing between the preamplifier and a current source, the preamplifier and the first insulating endcap arranged in a first plane parallel to a primary plane of the PCB, the preamplifier providing current to a read or write head.
10. The method of claim 9 , wherein the preamplifier subassembly includes at least two preamplifiers arranged in the first plane and separated from one another by the first insulating endcap.
11. The method of claim 9 , wherein the first decoupling capacitor is arranged in a second plane parallel to the PCB and the first plane, the first decoupling capacitor aligned with the first insulating endcap and the PCB along an axis perpendicular to the PCB.
12. The method of claim 9 , wherein the first insulating endcap includes an epoxy molded compound (EMC).
13. The method of claim 9 , further comprising:
arranging a plurality of preamplifiers on a wafer;
depositing an insulating material over the plurality of preamplifiers to form an insulating layer encapsulating the preamplifiers; and
separating the wafer into different structures, each structure including at least one of the preamplifiers with opposing surfaces encased in the insulating material.
14. The method of claim 9 , wherein the first insulating endcap abuts a first surface of the preamplifier and a second insulating endcap abuts a second opposite surface of the preamplifier, the second insulating endcap including an electrical via coupling the PCB to a second decoupling capacitor arranged in the first plane.
15. The method of claim 14 , wherein the first decoupling capacitor and the second decoupling capacitor are arranged in a second plane parallel to the first plane and the PCB.
16. The method of claim 9 , wherein the PCB and the preamplifier subassembly are positioned on an actuator arm and the first decoupling capacitor reduces noise between the preamplifier and at least one read or write head.
17. The method of claim 9 , wherein the first insulating endcap separates the first decoupling capacitor from underlying electrical connections formed on the PCB.
18. A printed circuit board assembly comprising:
a printed circuit board (PCB);
a preamplifier subassembly electrically coupled to the PCB and including at least a first preamplifier and a second preamplifier arranged in a second plane parallel to a primary plane of the PCB, the first preamplifier and the second preamplifier separated from one another by a first insulating endcap including an electrical via that provides an electrical connection between a decoupling capacitor and at least one of the PCB and the preamplifier to reduce noise detectable in current flowing between a current source and at least one of the first preamplifier or the second preamplifier.