Method for manufacturing conductive pattern forming member

1. A method for manufacturing a conductive pattern forming member, comprising:

a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C;

a drying step of drying the coating film C to obtain a dry film C;

an exposure step of exposing the dry film C to light to obtain an exposed film C;

a developing step of developing the exposed film C to obtain a pattern C; and

a curing step of curing the pattern C to obtain a conductive pattern C,

wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.

2. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein particles having a particle diameter of 0.5 to 1.5 μm account for 80% or more of the conductive particles.

3. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C further contains a photopolymerization initiator.

4. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the resin (c) having a double bond and a carboxyl group is an acrylic resin having an acid value of 50 to 250 mg KOH/g.

5. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the transparent electrode layer B contains silver and the composition C contains silver particles as the conductive particles.

6. The method for manufacturing a conductive pattern forming member according to claim 5 , wherein the silver contained in the transparent electrode layer B is in a fibrous form.

7. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C contains an alcoholic solvent having a boiling point of 200° C. or more.

8. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the drying step is carried out at a temperature of 50 to 80° C.

9. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the developing step is carried out at a development pressure of 0.02 to 0.2 MPa.

10. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein the composition C contains an epoxy resin.

11. The method for manufacturing a conductive pattern forming member according to claim 1 , wherein a difference between an acid value SA of the layer A formed of the resin (a) having a carboxyl group and an organic component acid value SC of the conductive pattern C is 20 to 150 mg KOH/g.

12. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the conductive pattern C contains a compound having a urethane linkage.

13. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the conductive pattern C contains a compound having a cyclohexane skeleton.

14. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein an optical clear adhesive layer D stacked on any of the layer A, the transparent electrode layer B and the conductive pattern C contains isobornyl skeleton.

15. A conductive pattern forming member produced by the method for manufacturing a conductive pattern forming member according to claim 1 , wherein the layer D contains a benzotriazole-based compound.