IP Library Granted Patent US 10,828,855
Granted Patent B2
US 10,828,855 · App. 15/684,530 · Granted Nov 10, 2020

Monolithic high refractive index photonic devices

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Quick Facts
Patent No.
US 10,828,855
App. No.
15/684,530
Granted
Nov 10, 2020
Kind
B2
Abstract

Fabricating a high refractive index photonic device includes disposing a polymerizable composition on a first surface of a first substrate and contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate. The polymerizable composition is cured to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in the range of 10 μm to 1 cm. The polymeric structure is separated from the first substrate and the second substrate to yield a monolithic photonic device having a refractive index of at least 1.6.

Claims (40)

1. A method of fabricating a high refractive index photonic device, the method comprising:

heating a first substrate to at least 100° C.;

disposing a polymerizable composition on a first surface of the first substrate after heating the first substrate to at least 100° C.;

contacting the polymerizable composition with a first surface of a second substrate, thereby spreading the polymerizable composition on the first surface of the first substrate;

curing the polymerizable composition to yield a polymeric structure having a first surface in contact with the first surface of the first substrate, a second surface opposite the first surface of the polymeric structure and in contact with the first surface of the second substrate, and a selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure in a range of 10 μm to 1 cm; and

separating the polymeric structure from the first substrate and the second substrate to yield a monolithic photonic device,

wherein the refractive index of the monolithic photonic device is at least 1.6, and

further comprising heating the second substrate to a temperature that exceeds the temperature of the first substrate by 25° C. to 50° C. at the time the polymerizable composition is disposed on the first surface of the first substrate.

2. The method of claim 1 , further comprising coating the first surface of the first substrate with a release layer before disposing the polymerizable composition on the first surface of the first substrate.

3. The method of claim 1 , wherein curing the polymerizable composition comprises heating the polymerizable composition to a temperature less than 100° C.

4. The method of claim 1 , wherein the selected residual layer thickness between the first surface of the polymeric structure and the second surface of the polymeric structure is in a range of 250 μm to 500 μm.

5. The method of claim 1 , wherein a transmittance of the monolithic photonic device is greater than 80% between 400 nm and 800 nm.

6. The method of claim 1 , further comprising coating the first surface of the second substrate with a release layer before contacting the polymerizable composition with the first surface of the second substrate.

7. The method of claim 1 , further comprising heating the second substrate to at least 100° C. before contacting the polymerizable composition with the first surface of the second substrate.

8. The method of claim 1 , further comprising partially polymerizing the polymerizable composition before disposing the polymerizable composition on the first surface of the first substrate.

9. The method of claim 1 , wherein the polymerizable composition comprises:

first monomers, each first monomer having at least two vinyl, allyl, or acrylate moieties; and

second monomers, each second monomer having at least two thiol moieties.

10. The method of claim 9 , wherein the polymerizable composition comprises a photoinitiator, a thermal initiator, or both.

11. The method of claim 9 , wherein the polymerizable composition comprises a metal oxide.

12. The method of claim 11 , wherein the metal oxide comprises at least one of titanium oxide, zirconium oxide, and zinc oxide.

13. The method of claim 9 , wherein the polymerizable composition comprises a surfactant.

14. The method of claim 1 , wherein the monolithic photonic device is optically transparent.

15. The method of claim 1 , wherein the polymerizable composition comprises:

20 wt % to 90 wt % of a high viscosity multifunctional component;

5 wt % to 40 wt % of a low viscosity mono- or multifunctional component;

0.2 wt % to 5 wt % of a photoinitiator;

0.2 wt % to 2 wt % of a light stabilizer; and

0.2 wt % to 2 wt % of an antioxidant,

wherein curing the polymerizable composition comprises polymer crosslinking through a single functionality.

16. The method of claim 15 , wherein the polymerizable composition comprises inorganic nanoparticles or molecular level clusters.

17. The method of claim 1 , wherein the polymerizable composition comprises:

20 wt % to 80 wt % of a multifunctional component with a first reactive moiety;

20 wt % to 80 wt % of a multifunctional component with a second reactive moiety;

0.2 wt % to 5 wt % of a photoinitiator;

0.2 wt % to 2 wt % of a light stabilizer; and

0.2 wt % to 2 wt % of an antioxidant,

wherein the first reactive moiety and the second reactive moiety are different, and curing the polymerizable composition comprises polymer crosslinking through cross-reaction through at least the first reactive moiety and the second reactive moiety.

18. The method of claim 17 , wherein the polymerizable composition comprises inorganic nanoparticles having a maximum particle size of 20 nm.

19. The method of claim 1 , wherein the monolithic photonic device is a lens.

Assignments (6)
SECURITY INTEREST Recorded Oct 28, 2025
From: MAGIC LEAP, INC.; MENTOR ACQUISITION ONE, LLC; MOLECULAR IMPRINTS, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073388/0027 →
SECURITY INTEREST Recorded Oct 15, 2025
From: MAGIC LEAP, INC.; MENTOR ACQUISITION ONE, LLC; MOLECULAR IMPRINTS, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073109/0238 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Nov 7, 2019
From: JPMORGAN CHASE BANK, N.A.
To: CITIBANK, N.A.
Reel/Frame 050967/0138 →
PATENT SECURITY AGREEMENT Recorded Aug 22, 2019
From: MAGIC LEAP, INC.; MOLECULAR IMPRINTS, INC.; MENTOR ACQUISITION ONE, LLC
To: JP MORGAN CHASE BANK, N.A.
Reel/Frame 050138/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: BHAGAT, SHARAD D.; PEROZ, CHRISTOPHE; SINGH, VIKRAMJIT; XU, FRANK
To: MOLECULAR IMPRINTS, INC.
Reel/Frame 043591/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2017
From: BHAGAT, SHARAD D.; PEROZ, CHRISTOPHE; SINGH, VIKRAMJIT; XU, FRANK Y.
To: MOLECULAR IMPRINTS, INC.
Reel/Frame 043591/0918 →