Light-emitting device and manufacturing method thereof
View Patent ↗The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.
1. A light-emitting device comprising:
a light-emitting stack having a top surface, wherein the top surface comprises a first region and a second region;
a semiconductor stack under the light-emitting stack opposite to the top surface, wherein the semiconductor stack has a first surface closer to the light-emitting stack and a second surface opposite to the first surface, and comprises a first semiconductor layer and a second semiconductor layer closer to the second surface than the first semiconductor layer;
an electrode on the first region;
a void formed in the first semiconductor layer and the second semiconductor layer;
a substrate disposed under the second surface; and
a bonding layer formed between the second surface and the substrate;
wherein, in a cross-sectional view, the second region covers the void, and wherein an aluminum content in the first semiconductor layer is greater than the aluminum content in the second semiconductor layer.
2. The light-emitting device of claim 1 , wherein the void is only under the second region.
3. The light-emitting device of claim 1 , further comprising a transparent conductive layer between the second surface and the bonding layer.
4. The light-emitting device of claim 3 , wherein the transparent conductive layer comprises indium tin oxide (ITO), aluminum zinc oxide (AZO), cadmium tin oxide, antimony tin oxide, zinc oxide (ZnO) or zinc tin oxide.
5. The light-emitting device of claim 3 , further comprising a metal layer between the transparent conductive layer and the bonding layer, wherein the metal layer comprises gold (Au), silver (Ag) or aluminum (Al).
6. The light-emitting device of claim 1 , wherein the bonding layer comprises gold (Au), indium (In) or an alloy thereof.
7. The light-emitting device of claim 1 , wherein the substrate comprises silicon (Si) or silicon carbide (SiC).
8. The light-emitting device of claim 1 , wherein the second region is rougher than the first region.
9. The light-emitting device of claim 1 , wherein the semiconductor stack comprises aluminum arsenide (AlAs) and/or aluminum gallium arsenide (Al x Ga 1-x As).
10. The light-emitting device of claim 1 , wherein the first semiconductor layer comprises aluminum arsenide (AlAs) and/or aluminum gallium arsenide (Al x Ga 1-x As, wherein 0.5≤x<1).
11. The light-emitting device of claim 1 , wherein the second semiconductor layer does not comprise aluminum (Al).
12. The light-emitting device of claim 11 , wherein a portion of the second semiconductor layer is exposed from the first semiconductor layer.
13. The light-emitting device of claim 1 , further comprising a passivation layer covering the light-emitting stack and the first semiconductor layer and exposing the second semiconductor layer.
14. The light-emitting device of claim 1 , wherein the semiconductor stack further comprises a third semiconductor layer between the first semiconductor layer and the second semiconductor layer and the void is further formed in the third semiconductor layer.
15. The light-emitting device of claim 14 , wherein the aluminum content in the first semiconductor layer is greater than the aluminum content in the third semiconductor layer.