Semiconductor device including oxide semiconductor layer having regions with different resistances
A semiconductor device includes an n-type oxide semiconductor layer, a gate electrode above the oxide semiconductor layer, a gate insulation layer between the oxide semiconductor layer and the gate electrode, a first terminal connected to the oxide semiconductor layer, and a second terminal connected to the gate electrode, a potential applied to the second terminal being higher than a potential applied to the first terminal.
1. A semiconductor device comprising:
an n-type oxide semiconductor layer;
a gate electrode above the oxide semiconductor layer;
a gate insulation layer between the oxide semiconductor layer and the gate electrode;
a first terminal connected to the oxide semiconductor layer; and
a second terminal connected to the gate electrode, a potential applied to the second terminal being higher than a potential applied to the first terminal;
wherein the oxide semiconductor layer is arranged with a first region overlapping the gate electrode in a planar view and a second region exposed from the gate electrode in a planar view, a resistance of the oxide semiconductor layer in the second region being lower than a resistance of the oxide semiconductor layer in the first region, and
there are more impurities included in the oxide semiconductor layer in the second region than impurities included in the oxide semiconductor layer in the first region.
2. A semiconductor device comprising:
an n-type oxide semiconductor layer;
a gate electrode above the oxide semiconductor layer;
a gate insulation layer between the oxide semiconductor layer and the gate electrode;
a first terminal connected to the oxide semiconductor layer; and
a second terminal connected to the gate electrode, a potential applied to the second terminal being higher than a potential applied to the first terminal;
wherein
the oxide semiconductor layer is arranged with a first region overlapping the gate electrode in a planar view and a second region exposed from the gate electrode in a planar view, a resistance of the oxide semiconductor layer in the second region being lower than a resistance of the oxide semiconductor layer in the first region, and
there are more oxygen defects included in the oxide semiconductor layer in the second region than oxygen defects included in the oxide semiconductor layer in the first region.
3. The semiconductor device according to claim 2 , further comprising:
an insulation layer covering the oxide semiconductor layer, the gate insulation layer and the gate electrode;
wherein
the oxide semiconductor layer in the second region is exposed from the gate insulation layer and is in contact with the insulation layer.
4. The semiconductor device according to claim 3 , wherein the insulation layer includes silicon nitride.
5. A semiconductor device comprising:
a p-type oxide semiconductor layer;
a gate electrode above the oxide semiconductor layer;
a gate insulation layer between the oxide semiconductor layer and the gate electrode;
a first terminal connected to the oxide semiconductor layer; and
a second terminal connected to the gate electrode, a potential applied to the second terminal being lower than a potential applied to the first terminal;
wherein
the oxide semiconductor layer is arranged with a first region overlapping the gate electrode in a planar view and a second region exposed from the gate electrode in a planar view, a resistance of the oxide semiconductor layer in the second region being lower than a resistance of the oxide semiconductor layer in the first region, and
there are more impurities included in the oxide semiconductor layer in the second region than impurities included in the oxide semiconductor layer in the first region.
6. A semiconductor device comprising:
a p-type oxide semiconductor layer;
a gate electrode above the oxide semiconductor layer;
a gate insulation layer between the oxide semiconductor layer and the gate electrode;
a first terminal connected to the oxide semiconductor layer; and
a second terminal connected to the gate electrode, a potential applied to the second terminal being lower than a potential applied to the first terminal;
wherein
the oxide semiconductor layer is arranged with a first region overlapping the gate electrode in a planar view and a second region exposed from the gate electrode in a planar view, a resistance of the oxide semiconductor layer in the second region being lower than a resistance of the oxide semiconductor layer in the first region, and
there are more oxygen defects included in the oxide semiconductor layer in the second region than oxygen defects included in the oxide semiconductor layer in the first region.
7. The semiconductor device according to claim 6 , further comprising:
an insulation layer covering the oxide semiconductor layer, the gate insulation layer and the gate electrode;
wherein
the oxide semiconductor layer in the second region is exposed from the gate insulation layer and is in contact with the insulation layer.
8. The semiconductor device according to claim 7 , wherein the insulation layer includes silicon nitride.