LIGHT MODULE HAVING A HEATSINK CRIMPED AROUND A LENS, AND A METHOD FOR CRIMPING A HEAT SINK AROUND A LENS OF A LIGHT MODULE
A device is provided that includes a lens for covering a printed circuit board having a light emitting diode. The lens forms an arc in a lateral cross-section and includes two first edges at the ends of the arc. The arc spans a width of the printed circuit board and defines a space between the lens and the printed circuit board. The device also includes a heatsink adapted to couple to the printed circuit board and which extends substantially the width and the length of the printed circuit board. The heatsink includes two second edges along the length of the printed circuit board. One of the edges of the lens is positioned in a channel on one of the second edges of the heatsink, and the channel is crimped. A method is provided that includes providing a crimping a channel around a lens.
1 . A device comprising:
a lens for covering a printed circuit board having at least one light emitting diode, the lens forming an arc in a lateral cross-section, the lens including at least two first edges at the ends of the arc, the arc spanning at least a width of the printed circuit board and defining a space between the lens and the printed circuit board, the lens extending along the at least two first edges substantially a length of the printed circuit board; and
a heatsink adapted to couple to the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including at least two second edges along the length of the printed circuit board, at least one of the first edges of the lens being positioned in at least one channel on at least one of the second edges of the heatsink, the at least one channel being crimped.
2 . The device of claim 1 , wherein:
the at least one of the first edges is at least two first edges of the lens;
the at least one channel is at least two channels;
the at least one of the second edges is at least two second edges of the heatsink; and
the at least two first edges of the lens being received in the at least two channels on respective ones of the at least two second edges of the heatsink, the at least two channels being crimped.
3 . The device of claim 1 , wherein the crimping forms a seal between the heatsink and the lens at the at least one channel.
4 . The device of claim 3 , wherein the crimping provides ingress protection from dust and liquids.
5 . The device of claim 3 , wherein sealant is provided in the at least one channel to improve the seal when the at least one channel is crimped.
6 . The device of claim 1 , wherein the heatsink comprises extruded aluminum.
7 . The device of claim 6 , wherein the crimping comprises mechanically deforming the aluminum heatsink to seal around the lens.
8 . The device of claim 1 , wherein the lens comprises translucent plastic.
9 . The device of claim 1 , wherein:
the printed circuit board is planar having the length in a longitudinal direction; and
the heatsink is coupled to the printed circuit board by positioning at least one third edge of the printed circuit board in at least one further channel on at least one of the second edges of the heatsink, the at least one further channel being crimped.
10 . The device of claim 1 , further comprising:
the printed circuit board interposed between the heatsink and the lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module;
at least one second light module; and
two endcaps arranged on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from ends of the first and second light modules to the printed circuit board.
11 . The device of claim 1 , wherein:
the heatsink forms a base of the arc in the lateral cross-section; and
the base spans substantially the width of the printed circuit board and is substantially parallel to the printed circuit board.
12 . A method for lighting, comprising:
providing a lens for covering a printed circuit board having at least one light emitting diode, the lens forming an arc in a lateral cross-section, the lens including at least two first edges at the ends of the arc, the arc spanning at least a width of the printed circuit board and defining a space between the lens and the printed circuit board, the lens extending along the at least two first edges substantially a length of the printed circuit board;
providing a heatsink adapted to couple to the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including at least two second edges along the length of the printed circuit board;
positioning at least one of the first edges of the lens in at least one channel on at least one of the second edges of the heatsink; and
crimping the at least one channel.
13 . The method of claim 12 , wherein:
the at least one of the first edges is at least two first edges of the lens;
the at least one channel is at least two channels;
the at least one of the second edges is at least two second edges of the heatsink;
the positioning operation is of at least two of the first edges of the lens in at least two channels on the at least two second edges of the heatsink; and
the crimping operation is of the at least two channels.
14 . The method of claim 12 , wherein the crimping operation comprises forming a seal between the heatsink and the lens at the at least one channel.
15 . The method of claim 12 , wherein the crimping operation comprises providing ingress protection from dust and liquids.
16 . The method of claim 12 , further comprising providing sealant in the at least one channel to improve the seal, the providing sealant operation being performed one of:
before, during, and after the crimping operation is performed.
17 . The method of claim 12 , wherein
the heatsink comprises extruded aluminum; and
the crimping operation comprises mechanically deforming the aluminum heatsink to seal around the lens.
18 . The method of claim 12 , wherein the printed circuit board is planar having the length in a longitudinal direction, and further comprising:
positioning at least one third edge of the printed circuit board in at least one further channel on at least one of the second edges of the heatsink; and
further crimping the at least one further channel of the heatsink around the at least one third edge of the printed circuit board, the further crimping operation and the crimping operation being performed substantially simultaneously.
19 . The method of claim 12 , further comprising:
positioning the printed circuit board between the heatsink and the lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module;
providing at least one second light module; and
arranging two endcaps on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from ends of the first and second light modules to the printed circuit board.