Apparatus for forming a multilayered shaped film product
Apparatus includes a mask having an aperture corresponding to the desired shaped film product, a mask support arranged and configured to support the mask, and a system for delivering a plurality of film-forming compositions to the mask aperture. The system includes a plurality of film-forming composition reservoirs in fluid communication with at least one pump to deliver the film-forming compositions to the mask aperture; a pump controller to control the flow of the film-forming compositions, and a multistream nozzle arranged and configured to receive the film-forming compositions and to deliver them to the mask aperture.
1. An apparatus for forming a multilayered shaped film product comprising;
a. a mask having an aperture corresponding to the desired shaped film product;
b. a mask support arranged and configured to support the mask;
c. a system for delivering a plurality of film-forming compositions to the mask aperture comprising a plurality of film-forming composition reservoirs in fluid communication with at least one pump to deliver the film-forming compositions to the mask aperture; a pump controller to control the flow of the film-forming compositions, and a multistream nozzle arranged and configured to receive the film-forming compositions and to deliver them to the mask aperture.
2. The apparatus of claim 1 , wherein the at least one pump is a multichambered pump.
3. The apparatus of claim 1 wherein the at least one pump is a plurality of pumps.
4. The apparatus of claim 1 further comprising a substrate disposed between the mask support and the mask.
5. The apparatus of claim 1 wherein the mask support has a release lined surface whereby a shaped film product formed in the apparatus may be removed therefrom.
6. The apparatus of claim 1 wherein the system for delivering a plurality of film-forming compositions to the mask aperture is arranged and configured to deliver the film-forming compositions to the mask aperture in a substantially laminar flow.