Method of manufacturing support structures for lighting devices and corresponding device
A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.
1. A method of manufacturing support elements for lighting devices, the method comprising:
providing a printed circuit board module by:
providing an elongated, electrically non-conductive substrate with opposed surfaces, said substrate having an electrically-conductive layer extending along one of said opposed surfaces,
etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along said non-conductive substrate with at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks at the one of said opposed surfaces along which said set of electrically-conductive tracks extends,
printing at said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks, a network of electrically-conductive lines coupleable with at least one electrically-powered light radiation source,
mounting at least one electrically-powered light radiation source on the printed circuit board module, wherein said mounting comprises coupling the at least one electrically-powered light radiation source exclusively to the network of electrically-conductive lines via solder masses or an electrically-conductive adhesive; and
electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines by means of electrically-conductive elements mounted at the one of said opposed surfaces of the non-conductive substrate, wherein the electrically-conductive elements include SMD components with zero ohmic value.
2. The method of claim 1 , further comprising:
forming said network of electrically-conductive lines on the other of said opposed surfaces of said non-conductive substrate, and
electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines by means of electrically conductive vias extending through said non-conductive substrate.
3. The method of claim 1 , further comprising providing a base layer covering said set of electrically conductive tracks at said one of said opposed surfaces of the non-conductive substrate.
4. The method of claim 1 , wherein said electrically non-conductive substrate includes a ribbon-like flexible member.
5. The method of claim 1 , wherein said at least one portion of said non-conductive substrate left free by said set of electrically-conductive tracks includes a flat portion.
6. The method of claim 1 , further comprising electrically coupling to said network of electrically-conductive lines at least one electrically-powered light radiation source of the LED type.
7. The method of claim 1 , wherein the electrically-conductive elements are arranged directly between the set of electrically-conductive tracks and the network of electrically-conductive lines.
8. The method of claim 1 , wherein the electrically-conductive layer is arranged over an outer surface of the electrically non-conductive substrate.