IP Library Granted Patent US 10,181,694
Granted Patent B2
US 10,181,694 · App. 15/690,592 · Granted Jan 15, 2019

Optical module

Inventors: Kohichi Robert Tamura (Kanagawa, JP); Takanori Suzuki (Tokyo, JP); Mitsuo Akashi (Kanagawa, JP); Shigehisa Tanaka (Tokyo, JP); Hiroaki Inoue (Saitama, JP); Hiroyasu Sasaki (Kanagawa, JP)
Assignee: Oclaro Japan, Inc.
H01S5/02248G02B6/34H01S5/0064H01S5/0261H01S5/02276H01S5/02288H01S5/02292H01S5/18388G02B6/4214G02B6/4271H01L2224/48463H01L2224/73265
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Quick Facts
Patent No.
US 10,181,694
App. No.
15/690,592
Granted
Jan 15, 2019
Kind
B2
Abstract

An optical module includes a semiconductor optical device in which an active layer located at one side, an electrode located at the same side, and a mirror that reflects light toward the side opposite the electrode are monolithically integrated, a sub-mount having one surface on which a first wiring pattern is formed, a substrate in which an optical waveguide and a grating coupler are formed in a surface layer of the substrate, a spacer having an upper surface on which a second wiring pattern is formed, and a wire. The sub-mount is mounted on the spacer. The first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto. The second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

Claims (19)

1. An optical module comprising:

a substrate having an optical waveguide being formed in a surface layer;

a semiconductor optical device in which an active layer, a first electrode, and a mirror are integrated, the mirror changing an optical path of light emitting from the active layer toward a side of the substrate;

a sub-mount having a first wiring pattern formed on one surface thereof and on which the semiconductor optical device is surface mounted such that the first electrode faces the first wiring pattern;

a spacer mounted on the substrate apart from a region where the light enters the side of the substrate, having an upper surface on a side opposite the substrate, and having a second wiring pattern formed on the upper surface; and

a wire,

wherein the sub-mount is mounted on the spacer,

wherein the first wiring pattern on the sub-mount faces part of the second wiring pattern on the spacer and is electrically connected thereto, and

wherein the second wiring pattern on the spacer includes a pad being disposed in a region exposed from the sub-mount and being bonded to the wire.

2. The optical module according to claim 1 ,

wherein a grating coupler is formed in the region where the light enters the side of the substrate.

3. The optical module according to claim 1 ,

wherein a lens focusing the light from the mirror is further monolithically integrated with the semiconductor optical device.

4. The optical module according to claim 1 ,

further comprising a lens substrate which is disposed between the substrate and the spacer and on which a lens that focuses the light is formed.

5. The optical module according to claim 1 ,

wherein the active layer is applied electricity by the first electrode.

6. The optical module according to claim 5 ,

wherein the semiconductor optical device includes a second electrode at a surface opposite to a surface facing the first wiring pattern.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Aug 14, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 050467/0488 →
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 051538/0295 →
Priority Claims (1)
JP 2015-164254 · Aug 21, 2015 · national
Continuity (2)
Continuation 15240022 · Aug 18, 2016
Related Publication 20170365977A1 · Dec 21, 2017