System and method for retaining memory modules
The present invention is an apparatus and method for allowing for the use of commercial dual inline memory module (DIMM) in high shock and vibration environments while preserving serviceability. This system extends the performance of the standard Joint Electron Device Engineering (JEDEC) memory connectors in said environments without sacrificing high speed electrical performance. The system provides a simple clip which locks the module in place using the standard connector latches preventing relative motion of the connector and the DIMM thereby insuring uninterrupted computational performance. The clip may be formed with resilient ends that snap onto pivotal latching devices to prevent inadvertent opening of these latching devices. The clips may also include bumper spacers ( 205 ) on their opposite faces to engage bumper spacers of adjacent clips to maintain the modules in proper orientation.
1. A system for reducing inadvertent disconnection of memory modules during operation in harsh environments comprising:
a plurality of disconnection protected systems arranged in a parallel array; wherein each of said plurality of disconnection protected systems comprises:
a DIMM connector 120 ;
a DIMM memory module 110 , having a memory module top edge 108 ;
a retention clip 200 having:
a retention clip central portion 208 , having a retention clip first end 202 and retention clip second end 204 ;
a retention clip first angled portion 212 and retention clip second angled portion 214 disposed on opposing ends of said retention clip central portion 208 ;
a retention clip first latch engaging end 222 and a retention clip second latch engaging end 224 disposed on said retention clip first angled portion 212 and retention clip second angled portion 214 , respectively;
said retention clip central portion 208 having a retention clip central portion top side 209 and a retention clip central portion bottom side 207 , which has a retention clip bottom side top edge receiving groove 203 disposed therein, which is configured to receive therein said memory module top edge 108 ;
a plurality of retention clip first face bumper spacers 206 ;
a plurality of retention clip second face bumper spacers 205 ;
a retention clip first latch engaging tab 232 disposed on an interior side of said retention clip first latch engaging end 222 ;
a retention clip second latch engaging tab 234 disposed on an interior side said retention clip second latch engaging end 224 facing said retention clip first latch engaging tab 232 ; and
wherein said array is spatially configured such that each retention clip 200 in said plurality of disconnection protected systems has at least one of said plurality of retention clip first face bumper spacers 206 and said plurality of retention clip second face bumper spacers 205 thereon in contact with one of said plurality of retention clip first face bumper spacers 206 and said plurality of retention clip second face bumper spacers 205 of another retention clip 200 of said plurality of disconnection protection systems.
2. A system for reducing inadvertent disconnection of memory modules during operation in harsh environments comprising:
a DIMM connector, having a first pivoting latch and a second pivoting latch;
a DIMM memory module, having a memory module top edge;
a retention clip having:
a retention clip central portion having a retention clip central portion top side, a retention clip central portion bottom side, a retention clip central portion first face extending between said retention clip central portion bottom side and said retention clip central portion top side, a retention clip central portion second face opposite said retention clip central portion first face;
a retention clip first latch engaging end and a retention clip second latch engaging end engaged with opposing ends of said DIMM memory module and disposed beneath and in contact with an upper portion of said first pivoting latch and said second pivoting latch, respectively;
wherein said retention clip first latch engaging end and said retention clip second latch engaging end each provide a biasing force which tends to prevent rotation of first pivoting latch and second pivoting latch, respectively;
a retention clip bottom side top edge receiving groove disposed in said retention clip central portion bottom side and running along a longitudinal axis of said retention clip aligned with a line drawn from said retention clip first latch engaging end and said retention clip second latch engaging end;
said retention clip bottom side top edge receiving groove having a depth dimension which is orthogonal to said longitudinal axis and which limits an insertion distance of said memory module top edge;
said retention clip further having a retention clip first face bumper spacer which protrudes from said retention clip central portion first face in a direction which is orthogonal to both said longitudinal axis and said depth dimension; and
said retention clip further having a retention clip second face bumper spacer which protrudes from said retention clip central portion second face in a direction which is orthogonal to both said longitudinal axis and said depth dimension.
3. The system of claim 2 wherein said retention clip first latch engaging end and retention clip second latch engaging end are pivotably mounted to opposing ends of said DIMM memory module.
4. The system of claim 2 wherein said retention clip first latch engaging end and retention clip second latch engaging end are disposed on opposing ends of a retention clip central portion which is disposed on said memory module top edge.
5. The system of claim 4 further comprising:
a plurality of retention clip first face bumper spacers disposed on said retention clip central portion; and
a plurality of retention clip second face bumper spacers disposed on said retention clip central portion.
6. The system of claim 4 wherein said retention clip central portion further comprises:
a. a retention clip central portion bottom side; and
b. a retention clip bottom side top edge receiving groove disposed in said retention clip central portion bottom side, which is configured to receive therein said memory module top edge.
7. The system of claim 4 wherein said retention clip central portion further comprises: a retention clip central portion top side positioned and configured to be contacted by a lid.
8. The system of claim 7 further comprising a first end lid contacting buttress and a second end lid contacting buttress.
9. The system of claim 2 wherein said retention clip first face bumper spacer comprises a first plurality of spaced apart protuberances on said retention clip central portion first face.
10. The system of claim 9 wherein said retention clip second face bumper spacer comprises a second plurality of spaced apart protuberances on said retention clip central portion second face.
11. The system of claim 10 wherein each of said first plurality of spaced apart protuberances is disposed opposite of one of said second plurality of spaced apart protuberances.
12. A system for reducing inadvertent disconnection of memory modules during operation in harsh environments comprising:
a DIMM connector, having a first pivoting latch and a second pivoting latch;
a DIMM memory module, having a memory module top edge;
a retention clip system having:
a retention clip first latch engaging end and a retention clip second latch engaging end engaged with opposing ends of said DIMM memory module and disposed beneath and in contact with an upper portion of said first pivoting latch and said second pivoting latch, respectively;
wherein said retention clip first latch engaging end and said retention clip second latch engaging end each provide a biasing force which tends to prevent rotation of first pivoting latch and second pivoting latch, respectively:
a retention clip first latch engaging tab disposed on said retention clip first latch engaging end;
a retention clip second latch engaging tab disposed on said retention clip second latch engaging end; and
wherein said retention clip first latch engaging tab and retention clip second latch engaging tab are configured to fit inside a slot in first pivoting latch and second pivoting latch, respectively.
13. The system of claim 12 wherein said retention clip first latch engaging end and retention clip second latch engaging end are pivotably mounted to opposing ends of said DIMM memory module.
14. The system of claim 12 wherein said retention clip first latch engaging end and retention clip second latch engaging end are disposed on opposing ends of a retention clip central portion which is disposed on said memory module top edge.
15. A method of reducing inadvertent disconnection of memory modules during operation in harsh environments comprising the steps of:
providing a retention clip configured with a retention clip first latch engaging end and a retention clip second latch engaging end:
providing a retention clip first latch engaging tab disposed on an interior side of said retention clip first latch engaging end;
providing a retention clip second latch engaging tab disposed on an interior side said retention clip second latch engaging end facing said retention clip first latch engaging tab;
installing a DIMM memory module into a DIMM connector having a first pivoting latch and a second pivoting latch;
engaging said retention clip with all of said DIMM memory module;
and
using said retention clip first latch engaging tab and retention clip second latch engaging tab for, engaging said retention clip first latch engaging end and said retention clip second latch engaging end respectively, with said first pivoting latch and said second pivoting latch, respectively.