Vertical and horizontal circuit assemblies
In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.
1. An apparatus comprising:
a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and
an inductor having a coil portion, a first terminal and a second terminal,
the coil portion of the inductor being disposed on a first side of the apparatus,
the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite the first side of the apparatus,
the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, and
the leadframe, the assembly and the inductor being arranged in a stacked configuration.
2. The apparatus of claim 1 , wherein the substrate includes one of a ceramic substrate or a multi-chip package.
3. The apparatus of claim 1 , further comprising a molding compound, the leadframe being at least partially disposed in the molding compound.
4. The apparatus of claim 3 , wherein the assembly is at least partially disposed in the molding compound.
5. The apparatus of claim 4 , wherein a surface of the substrate of the assembly is exposed through the molding compound.
6. The apparatus of claim 3 , wherein the first contact pad and the second contact pad are included in the leadframe, respective surfaces of the first contact pad and the second contact pad being exposed through the molding compound.
7. The apparatus of claim 1 , further comprising at least one passive device coupled with the leadframe.
8. The apparatus of claim 1 , wherein the plurality of leads includes at least one straight lead and at least one bent lead, the at least one straight lead being configured to be coupled with a through-hole of the printed circuit board and the at least one bent lead being configured to be mounted on a surface of the printed circuit board.
9. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are soldered, respectively, to the first contact pad and the second contact pad.
10. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are frictionally maintained in contact with, respectively, the first contact pad and the second contact pad.
11. The apparatus of claim 1 , wherein the first terminal of the inductor and the second terminal of the inductor are coupled with a same side of the leadframe on which the assembly is mounted.
12. An apparatus comprising:
a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and
an inductor having a coil portion, a first terminal, and a second terminal,
the coil portion of the inductor being disposed on a first side of the apparatus,
the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite that first side of the apparatus,
the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, and
the leadframe being disposed between the assembly and the coil portion of the inductor.
13. The apparatus of claim 12 , further comprising a molding compound, at least one of the leadframe or the assembly being at least partially disposed in the molding compound.
14. The apparatus of claim 13 , wherein a surface of the substrate of the assembly is exposed through the molding compound.
15. The apparatus of claim 13 , wherein the first contact pad and the second contact pad are included in the leadframe, respective surfaces of the first contact pad and the second contact pad being exposed through the molding compound.
16. The apparatus of claim 12 , wherein the plurality of leads includes at least one straight lead and at least one bent lead, the at least one straight lead being configured to be coupled with a through-hole of the printed circuit board and the at least one bent lead being configured to be mounted on a surface of the printed circuit board.
17. The apparatus of claim 12 , wherein the substrate includes one of a ceramic substrate or a multi-chip package.
18. The apparatus of claim 12 , further comprising at least one passive device coupled with the leadframe.
19. The apparatus of claim 12 , wherein the first terminal of the inductor and the second terminal of the inductor are frictionally maintained in contact with, respectively, the first contact pad and the second contact pad.
20. The apparatus of claim 12 , wherein the first terminal of the inductor and the second terminal of the inductor are coupled with a same side of the leadframe on which the assembly is mounted.