Packaged fast inverse diode component for PFC applications
A novel four-terminal packaged semiconductor device is particularly useful in a 400 volt DC output PFC boost converter circuit. Within the body of the package an NFET die and a fast inverse diode die are mounted such that a bottomside drain electrode of the NFET is electrically coupled via a die attach tab to a bottomside P type anode region of the inverse diode. First terminal T 1 is coupled the die attach tab. Second terminal T 2 is coupled to the gate of the NFET die. Third terminal T 3 is coupled to the source of the NFET die. Fourth terminal T 4 is coupled to a topside cathode electrode of the fast inverse diode die. Due to a novel P+ type charge carrier extraction region of the inverse diode die, the packaged device is fast and has a low reverse leakage current in the PFC boost converter circuit application.
1. A packaged semiconductor device comprising:
a first package terminal;
a die attach tab, wherein the die attach tab is coupled to the first package terminal;
an N-channel field effect transistor (NFET) die, wherein the NFET die has a topside gate electrode, a topside source electrode, and a bottomside drain electrode, wherein the bottomside drain electrode is mounted to the die attach tab;
an inverse diode die, wherein the inverse diode die comprises:
a bottomside P type silicon region that extends upward from a bottom semiconductor surface of the inverse diode die that also extends laterally outwardly to peripheral side edges of the inverse diode die;
an N− type silicon region disposed over the bottomside P type silicon region;
an N type depletion stopper region that extends downward from the top semiconductor surface and into the N− type silicon region;
a P+ type charge carrier extraction region that extends downward from the top semiconductor surface and into the N type depletion stopper region;
an N+ type contact region that extends downward from the top semiconductor surface and into the N type depletion stopper region;
a P type silicon peripheral sidewall region that extends downward from the top semiconductor surface into the N− type silicon region, wherein the P type silicon peripheral sidewall region joins the bottomside P type silicon region thereby forming a P type isolation structure, wherein the P type silicon peripheral sidewall region also laterally rings the N− type silicon region and separates the N type silicon region from the peripheral side edges of the inverse diode die;
a topside cathode electrode disposed on the N+ type contact region and on the P+ type charge carrier extraction region; and
a bottomside anode electrode disposed on the bottom semiconductor surface of the inverse diode die, wherein the bottomside anode electrode is mounted to the die attach tab;
a second package terminal that is coupled to the topside gate electrode of the NFET die;
a third package terminal that is coupled to the topside source electrode of the NFET die;
a fourth package terminal that is coupled to the topside cathode electrode of the inverse diode die; and
an amount of encapsulant that encapsulates the NFET die and the inverse diode die on the die attach tab portion of the first package terminal and die attach tab.
2. The packaged semiconductor device of claim 1 , wherein the inverse diode die has a reverse leakage current (I lk ) of less than 100 microamperes in a 450 volt static reverse blocking condition.
3. The packaged semiconductor device of claim 1 , wherein the first package terminal is an extension of the die attach tab, wherein the first package terminal and the die attach tab are two parts of a single piece of stamped metal.
4. The packaged semiconductor device of claim 1 , wherein the first package terminal is bonded to the die attach tab.
5. The packaged semiconductor device of claim 1 , wherein the first package terminal is coupled to the die attach tab via a bond wire.
6. The packaged semiconductor device of claim 1 , wherein the packaged semiconductor device has four and no more than four package terminals.
7. The packaged semiconductor device of claim 1 , wherein the inverse diode die has all of the following:
1) a low forward voltage drop (V f ) of less than 1.5 volts in a high current forward conduction condition of 10 amperes,
2) a peak reverse recovery current (I rr ) that is less than 5 amperes when the inverse diode die switches from the high current forward current condition to a 100 volt reverse voltage condition, 3) a reverse breakdown voltage (V br ) withstand capability of at least 550 volts, and
4) a reverse leakage current (I lk ) of less than 100 microamperes in a 450 volt static reverse blocking condition.
8. The packaged semiconductor device of claim 1 , wherein the NFET die has a breakdown voltage (BV DSS ) of at least 550 volts.
9. A packaged semiconductor device comprising:
a first package terminal;
a die attach tab, wherein the die attach tab is coupled to the first package terminal;
an N-channel field effect transistor (NFET) die, wherein the NFET die has a topside gate electrode, a topside source electrode, and a bottomside drain electrode, wherein the bottomside drain electrode is mounted to the die attach tab;
an inverse diode die, wherein the inverse diode die has a topside cathode electrode, a bottomside P type silicon region and a bottomside anode electrode, wherein the bottomside anode electrode is mounted to the die attach tab, wherein the die attach tab electrically couples the bottomside drain electrode of the NFET to the bottomside anode electrode of the inverse diode die;
a second package terminal that is coupled to the topside gate electrode of the NFET die;
a third package terminal that is coupled to the topside source electrode of the NFET die;
a fourth package terminal that is coupled to the topside cathode electrode of the inverse diode die; and
an amount of encapsulant that encapsulates the NFET die and the inverse diode die on the die attach tab portion of the first package terminal and die attach tab.
10. The packaged semiconductor device of claim 9 , wherein the first package terminal is an extension of the die attach tab, wherein the first package terminal and the die attach tab are two parts of a single piece of stamped metal.
11. The packaged semiconductor device of claim 9 , wherein the first package terminal is bonded to the die attach tab.
12. The packaged semiconductor device of claim 9 , wherein the first package terminal is coupled to the die attach tab via a bond wire.
13. The packaged semiconductor device of claim 9 , wherein the inverse diode die has a top semiconductor surface, the inverse diode die further comprising:
an N type depletion stopper region that extends downward from the top semiconductor surface and into an N− type silicon region;
a P+ type charge carrier extraction region that extends downward from the top semiconductor surface and into the N type depletion stopper region; and
an N+ type contact region that extends downward from the top semiconductor surface and into the N type depletion stopper region, wherein the topside cathode electrode is coupled to both the P+ type charge carrier extraction region and the N+ type contact region.
14. The packaged semiconductor device of claim 9 , wherein the inverse diode die has a reverse leakage current (I lk ) of less than 100 microamperes in a 450 volt static reverse blocking condition.
15. The packaged semiconductor device of claim 9 , wherein the inverse diode die has all of the following:
1) a low forward voltage drop (V f ) of less than 1.5 volts in a high current forward conduction condition of 10 amperes,
2) a peak reverse recovery current (I rr ) that is less than 5 amperes when the inverse diode die switches from the high current forward current condition to a 100 volt reverse voltage condition,
3) a reverse breakdown voltage (V br ) withstand capability of at least 550 volts, and
4) a reverse leakage current (Ilk) of less than 100 microamperes in a 450 volt static reverse blocking condition.
16. The packaged semiconductor device of claim 9 , wherein the packaged semiconductor device has four and no more than four package terminals.
17. A packaged semiconductor device comprising:
a first package terminal;
a substrate having a conductive surface, wherein the conductive surface is coupled to the first package terminal;
an N-channel field effect transistor (NFET) die, wherein the NFET die has a topside gate electrode, a topside source electrode, and a bottomside drain electrode,
wherein the bottomside drain electrode is mounted to the substrate;
means for conducting a current in a forward voltage condition and for blocking current flow in a reverse voltage condition, wherein the means has a topside metal electrode and a bottomside metal electrode, wherein the bottomside metal electrode is mounted to the substrate, wherein the means is for:
1) conducting a forward current with a forward voltage drop of less than 1.5 volts in a 10 ampere forward conduction condition,
2) switching from the forward conduction condition to a 100 volt reverse voltage condition without conducting a reverse recovery current of more than 5 amperes,
3) withstanding a reverse voltage of at least 550 volts without suffering reverse breakdown, and
4) withstanding a 450 volt static reverse blocking condition without conducting a reverse leakage current of more than 100 microamperes;
a second package terminal that is coupled to the topside gate electrode of the NFET die;
a third package terminal that is coupled to the topside source electrode of the NFET die;
a fourth package terminal that is coupled to the topside metal electrode of the means; and
an amount of encapsulant that encapsulates the NFET die and the means on the substrate.
18. The packaged semiconductor device of claim 17 , wherein the first package terminal is an extension of the substrate, wherein the first package terminal and the substrate are two parts of a single piece of stamped metal.
19. The packaged semiconductor device of claim 17 , wherein the first package terminal is bonded to the substrate.
20. The packaged semiconductor device of claim 17 , wherein the first package terminal is coupled to the substrate via a bond wire.