Mutual capacitance sensing array
A method and apparatus for sensing a conductive object by a mutual capacitance sensing array is described according to an embodiment of the present invention. The mutual capacitance sensing array comprises one or more sensor elements. Each sensor element comprises an outer frame including a conductive material. A cavity is formed within the interior of the outer frame.
1. An apparatus, comprising a mutual capacitance sensing array, the mutual capacitance sensing array comprising a plurality of sensor elements, each sensor element comprising an outer frame including a conductive material, the outer frame forming a single cavity within the interior therein, wherein an area of the cavity is substantially 50% to 90% of an area within the outer boundary of the sensor element.
2. The apparatus of claim 1 , wherein the conductive material is transparent.
3. The apparatus of claim 1 , further comprising a non-conductive dielectric material disposed in the cavity.
4. The apparatus of claim 3 , wherein the non-conductive dielectric material is co-planar with the outer frame.
5. The apparatus of claim 1 , wherein the outer frame has substantially a diamond shape.
6. The apparatus of claim 1 , further comprising a processing device coupled to the mutual capacitance sensing array, wherein the processing device is operable to detect a presence of a conductive object on the mutual capacitance sensing array.
7. The apparatus of claim 6 , wherein the mutual capacitance sensing array is disposed on a touch sensor screen.
8. The apparatus of claim 7 , wherein the mutual capacitance sensing array is disposed on a trackpad.
9. A method of forming a mutual capacitance sensor array, the method comprising:
forming an outer frame for a plurality of sensor elements, each outer frame comprising a conductive material, each outer frame forming a single cavity within the interior therein, wherein an area of the cavity is substantially 50% to 90% of an area within the outer boundary of the sensor element; and
interconnecting the plurality of sensor elements to form the mutual capacitance sensor array.
10. The method of claim 9 , wherein the outer frame has substantially a diamond shape.
11. The method of claim 9 , further comprising providing a non-conductive material disposed in the cavity.
12. The method of claim 9 , further comprising providing a processing device to detect a presence of a conductive object on the mutual capacitance sensor array.
13. The method of claim 12 , further comprising disposing the mutual capacitance sensor array on a touch sensor screen.
14. A system comprising:
a plurality of capacitive sensor elements configured in a mutual capacitance sensor array, each sensor element comprising an outer frame including a conductive material, the outer frame forming a single cavity within the interior therein, wherein the area of the cavity is substantially 50% to 90% of an area within the outer boundary of the sensor element; and
a mutual capacitance sensing circuit coupled to the plurality of sensor elements to detect the presence of a conductive object on the plurality of sensor elements.
15. The system of claim 14 , further comprising the plurality of sensor elements coupled to a touch screen.