METHOD OF SECURING A FINGERPRINT SENSOR ONTO A COVER MEMBER INCORPORATED WITHIN A HOST DEVICE PANEL

1 . A method for incorporating a fingerprint sensor assembly into a glass panel of a host device, the method comprising:

forming a recess in the host device panel;

placing a cover member into the hole and securing the glass cover member in the hole with securing material;

placing a fingerprint sensor assembly within the hole, under the glass cover member; and

securing the fingerprint sensor assembly within the hole.

2 . The method of claim 1 , wherein securing the cover member in the hole comprises cooling the cover member to reduce an out dimension thereof and placing the cooled cover member into the hole.

3 . The method of claim 1 , wherein securing the glass cover member in the hole comprises elevating the temperature of the host device panel to expand the hole and placing the cover member into the hole.

4 . The method of claim 1 , further comprising applying the securing material to the edge of the hole prior to placing the cover member into the hole.

5 . The method of claim 1 , wherein the securing material comprises an adhesive.

6 . The method of claim 4 , wherein the adhesive comprises a UV curable adhesive, a snap cure epoxy, or a cyanoacrylate adhesive.

7 . The method of claim 1 , wherein the fingerprint sensor assembly is incorporated into a spacer frame edgewise surrounding the fingerprint sensor assembly.

8 . The method of claim 1 , wherein the cover member is flush mounted or recess mounted into a glass panel of a host device.

9 . The method of claim 1 , wherein the cover member is made from glass.

10 . The method of claim 1 , wherein the cover member is flush with, recessed below, or projecting above a surface of the host device panel.

11 . A method for incorporating a fingerprint sensor assembly into a glass panel of a host device, the method comprising:

forming a recessed area in the host device panel;

forming an opening in the host device panel within the recessed area, wherein the size of the opening is smaller than the size of the recessed area;

placing a fingerprint sensor assembly within the opening; and

placing a cover member over the recessed area and the opening, and securing the glass cover member to the host device panel with securing material.

12 . The method of claim 11 , further comprising applying the securing material to the edge of the opening prior to placing the cover member into the hole.

13 . The method of claim 12 , wherein the securing material comprises an adhesive.

14 . The method of claim 13 , wherein the adhesive comprises a UV curable adhesive, a snap cure epoxy, or a cyanoacrylate adhesive.

15 . The method of claim 11 , wherein the cover member is made from glass.

16 . The method of claim 11 , wherein the cover member is flush with, recessed below, or projecting above a surface of the host device panel.

17 . A method for incorporating a fingerprint sensor assembly into a glass panel of a host device, the method comprising:

adhering a cover member to a surface of the fingerprint sensor assembly to form a covered fingerprint sensor assembly;

operatively connecting the fingerprint sensor assembly to the host device;

placing a glass panel over a portion of the host device, the glass panel having a hole formed therein to receive the covered fingerprint sensor assembly with an outer surface of the cover member exposed through the hole; and

securing the covered fingerprint sensor assembly within the hole.

18 . The method of claim 17 , wherein the cover member is made from glass.

19 . The method of claim 17 , wherein securing the covered fingerprint sensor assembly within the hole comprises dispensing an adhesive into a gap between the perimeter of the hole and the cover member.

20 . The method of claim 17 , wherein securing the covered fingerprint sensor assembly within the hole comprises molding the covered fingerprint sensor assembly in place within the hole.