IP Library Granted Patent US 10,199,797
Granted Patent B2
US 10,199,797 · App. 15/695,321 · Granted Feb 5, 2019

Light-emitting element module, atomic oscillator, and electronic apparatus

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Quick Facts
Patent No.
US 10,199,797
App. No.
15/695,321
Granted
Feb 5, 2019
Kind
B2
Abstract

A light-emitting element module includes: a Peltier device; a light-emitting element that is disposed on the Peltier device; and a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base and. When Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc 1 is temperature of the base, and Tc 2 is temperature of the lid, Ts<Tc 2 <Tc 1 is satisfied in a case of Tv<Ts.

Claims (33)

1. A light-emitting element module comprising:

a Peltier device;

a light-emitting element that is disposed on the Peltier device; and

a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base,

wherein when Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc 1 is temperature of the base, and Tc 2 is temperature of the lid, Ts<Tc 2 <Tc 1 is satisfied in a case of Tv<Ts,

wherein the lid includes a protrusion portion protruding to an opposite side to the base, and

wherein the lid includes a first portion which supports the protrusion portion, a second portion which is joined to the base and located laterally outward from the first portion in a plan view of the lid, a third portion located laterally outward from the first portion in the plan view which is located between the first potion and the second portion and has a thickness thinner than the first portion, and the second portion is located laterally outward from the third portion in the plan view.

2. The light-emitting element module according to claim 1 ,

wherein the lid includes a window which is disposed in the protrusion portion and through which light from the light-emitting element is transmitted.

3. The light-emitting element module according to claim 1 ,

wherein a thickness of the second portion is thinner than a thickness of the first portion.

4. The light-emitting element module according to claim 1 ,

wherein the pressure of an internal space of the package is lower than an atmospheric pressure.

5. The light-emitting element module according to claim 1 ,

wherein thermal conductivity of a material of the lid is higher than thermal conductivity of a material of the base.

6. An atomic oscillator comprising:

a light-emitting element module comprising:

a Peltier device;

a light-emitting element that is disposed on the Peltier device; and

a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base,

wherein when Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc 1 is temperature of the base, and Tc 2 is temperature of the lid, Ts<Tc 2 <Tc 1 is satisfied in a case of Tv<Ts,

wherein the lid includes a protrusion portion protruding to an opposite side to the base, and

wherein the lid includes a first portion which supports the protrusion portion, a second portion which is joined to the base and located laterally outward from the first portion in a plan view of the lid, a third portion located laterally outward from the first portion in the plan view which is located between the first potion and the second portion and has a thickness thinner than the first portion, and the second portion is located laterally outward from the third portion in the plan view.

7. The atomic oscillator according to claim 6 , further comprising:

a heat dissipation member that is in contact with at least a part of an outer surface of the lid.

8. An electronic apparatus comprising:

a light-emitting element module comprising:

a Peltier device;

a light-emitting element that is disposed on the Peltier device; and

a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base,

wherein when Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc 1 is temperature of the base, and Tc 2 is temperature of the lid, Ts<Tc 2 <Tc 1 is satisfied in a case of Tv<Ts,

wherein the lid includes a protrusion portion protruding to an opposite side to the base, and

wherein the lid includes a first portion which supports the protrusion portion, a second portion which is joined to the base and located laterally outward from the first portion in a plan view of the lid, a third portion located laterally outward from the first portion in the plan view which is located between the first potion and the second portion and has a thickness thinner than the first portion, and the second portion is located laterally outward from the third portion in the plan view.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2022
From: SEIKO EPSON CORPORATION
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 061301/0770 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2017
From: MAKI, YOSHIYUKI; SHIBATA, TSUNENORI; CHINDO, KOJI
To: SEIKO EPSON CORPORATION
Reel/Frame 043488/0248 →