IP Library Granted Patent US 10,845,127
Granted Patent B2
US 10,845,127 · App. 15/695,468 · Granted Nov 24, 2020

Cooling device

Inventors: Kensuke Aoki (Fuchu, JP); Takuya Hongo (Yokohama, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Infrastructure Systems & Solutions Corporation
F28D15/0266F28D15/02F28D15/025H01L23/427H05K7/20672F25B23/006F28F2250/06F28F2265/14
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Quick Facts
Patent No.
US 10,845,127
App. No.
15/695,468
Granted
Nov 24, 2020
Kind
B2
Abstract

A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

Claims (46)

1. A cooling device comprising:

an evaporator in which a refrigerant is vaporized by heat generated by a heating element;

a condenser which is located above the evaporator and in which the vaporized refrigerant is condensed by exchanging heat with an external fluid, the condenser comprising a plurality of cooling pipes into which the vaporized refrigerant is divided to be introduced;

a first connection pipe which comprises a first end portion communicating with the evaporator and a second end portion communicating with the condenser, and which guides the refrigerant vaporized in the evaporator to the condenser;

a second connection pipe which comprises a first end portion communicating with the condenser and a second end portion communicating with the evaporator, and which guides the refrigerant condensed in the condenser to the evaporator, wherein the second connection pipe is free of any check valve; and

only one third connection pipe connecting a portion of the first connection pipe positioned between the first end portion and the second end portion of the first connection pipe and a portion of the second connection pipe positioned between the first end portion and the second end portion of the second connection pipe, wherein

the first connection pipe comprises an upward piping portion, the upward piping portion having an inner circumferential surface and extending upward, the inner circumferential surface having an opening which is opened to a side of the upward piping portion, and

the only one third connection pipe is configured to provide a single fluid flow path, the only one third connection pipe is connected to the opening of the upward piping portion, the only one third connection pipe has an inner diameter which is larger than a minimum inner diameter of each of the plurality of cooling pipes, the upward piping portion of the first connection pipe is free of any connection branch for providing a fluid flow path other than the only one third connection pipe for allowing some liquid part of the refrigerant which is pushed toward the inner circumferential surface of the upward piping portion and is raised in the upward piping portion while being in contact with the inner circumferential surface by a vapored part of the refrigerant which is vaporized in the evaporator to be pushed into the only one third connection pipe when the some liquid part of the refrigerant reaches the opening.

2. The cooling device according to claim 1 , wherein

a connection position between the only one third connection pipe and the second connection pipe is lower than the condenser.

3. The cooling device according to claim 1 , further comprising:

a tank which is connected to the second connection pipe at a position lower than the condenser, and which is expandable according to pressure inside the second connection pipe,

wherein

a connection position between the only one third connection pipe and the second connection pipe is lower than a connection position between the tank and the second connection pipe.

4. The cooling device according to claim 1 , further comprising a plurality of heating elements including the heating element,

wherein:

the evaporator comprises a plurality of cases which are configured to be alternately disposed with the plurality of heating elements in a horizontal direction, and each of the plurality of cases includes a space which is configured to accommodate the refrigerant;

the first connection pipe communicates with an upper end portion of the space of each of the plurality of cases;

the second connection pipe communicates with a lower end portion of the space of each of the plurality of cases; and

a width of the space in a horizontal direction in which the plurality of heating elements and the plurality of cases are arranged is smaller than a width of the space in a substantially vertical direction, in regard to each of the plurality of cases.

5. The cooling device according to claim 1 , wherein the opening is provided in a middle part of the upward piping portion.

6. The cooling device according to claim 1 , wherein the upward piping portion extends in a substantially vertical direction.

7. The cooling device according to claim 1 , wherein the opening is opened in a radial direction of the upward piping portion.

8. A cooling device comprising:

an evaporator in which a refrigerant is vaporized by heat generated by a heating element;

a condenser which is located above the evaporator and in which the vaporized refrigerant is condensed by exchanging heat with an external fluid, the condenser comprising a plurality of cooling pipes into which the vaporized refrigerant is divided to be introduced;

a first connection pipe which comprises a first end portion communicating with the evaporator and a second end portion communicating with the condenser, and which guides the refrigerant vaporized in the evaporator to the condenser;

a second connection pipe which comprises a first end portion communicating with the condenser and a second end portion communicating with the evaporator, and which guides the refrigerant condensed in the condenser to the evaporator, wherein the second connection pipe is free of any check valve; and

only one third connection pipe connecting a portion of the first connection pipe positioned between the first end portion and the second end portion of the first connection pipe and a portion of the second connection pipe positioned between the first end portion and the second end portion of the second connection pipe, wherein

the first connection pipe comprises an upward piping portion, the upward piping portion having an inner circumferential surface and extending upward in a substantially vertical direction, the inner circumferential surface having an opening which is opened in a radial direction of the upward piping portion, and

the only one third connection pipe is configured to provide a single fluid flow path, the only one third connection pipe is connected to the opening of the upward piping portion and communicates with an inside of the upward piping portion, the only one third connection pipe has an inner diameter which is larger than a minimum inner diameter of each of the plurality of cooling pipes, and the upward piping portion of the first connection pipe is free of any connection branch for providing a fluid flow path other than the only one third connection pipe.

9. The cooling device according to claim 8 , wherein the opening is provided in a middle part of the upward piping portion.

10. The cooling device according to claim 1 , wherein

the inner diameter of the only one third connection pipe is larger than a maximum inner diameter of each of the plurality of cooling pipes.

11. The cooling device according to claim 1 , wherein

each of the plurality of cooling pipes extends in a substantially vertical direction, and an inner diameter of a lower end portion of each of the plurality of cooling pipes is larger than an inner diameter of an upper end portion of each of the plurality of cooling pipes, and

the inner diameter of the only one third connection pipe is larger than the inner diameter of the lower end portion of each of the plurality of cooling pipes.

12. The cooling device according to claim 11 , wherein

the inner diameter of the only one third connection pipe is larger than the inner diameter of the upper end portion of each of the plurality of cooling pipes.

13. The cooling device according to claim 8 , wherein

the inner diameter of the only one third connection pipe is larger than a maximum inner diameter of each of the plurality of cooling pipes.

14. The cooling device according to claim 8 , wherein

each of the plurality of cooling pipes extends in the substantially vertical direction, and an inner diameter of a lower end portion of each of the plurality of cooling pipes is larger than an inner diameter of an upper end portion of each of the plurality of cooling pipes, and

the inner diameter of the only one third connection pipe is larger than the inner diameter of the lower end portion of each of the plurality of cooling pipes.

15. The cooling device according to claim 14 , wherein

the inner diameter of the only one third connection pipe is larger than the inner diameter of the upper end portion of each of the plurality of cooling pipes.

Assignments (2)
MERGER Recorded Jul 29, 2025
From: TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 072239/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2017
From: AOKI, KENSUKE; HONGO, TAKUYA
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
Reel/Frame 044087/0428 →
Priority Claims (1)
JP 2015-045166 · Mar 6, 2015 · national
Continuity (2)
Continuation PCTJP2015085034 · Dec 15, 2015
Related Publication 20170363365A1 · Dec 21, 2017