Semiconductor device and display device

1. A semiconductor device comprising:

a first resin layer;

one or more first wirings above the first resin layer;

a second resin layer above the first wiring, the second resin layer including a first opening part;

a transistor above the second resin layer, the transistor including a semiconductor layer, a gate insulation layer, and a gate electrode layer; and

a second wiring above the second resin layer, the second wiring being connected to the transistor and connected to the first wiring via the first opening part.

2. The semiconductor device according to claim 1 , further comprising:

a first barrier layer between the first resin layer and the first wiring.

3. The semiconductor device according to claim 2 , further comprising:

a second barrier layer between the second resin layer and the transistor, the second barrier layer having a second opening part;

wherein

the second wiring is connected to the first wiring via the first opening part and the second opening part.

4. The semiconductor device according to claim 1 , wherein the first wiring includes a plurality of first sensor wirings for detecting an input operation from the exterior.

5. The semiconductor device according to claim 4 , wherein the plurality of first sensor wirings can be alternately and independently controlled.

6. The semiconductor device according to claim 5 , further comprising:

a second sensor wiring connected to the second wiring, the second sensor wiring forming a capacitance with the first sensor wiring;

wherein

the plurality of first sensor wirings have a long side in a first direction and the plurality of second sensor wirings have a long side in a second direction intersecting the first direction.

7. The semiconductor device according to claim 1 , further comprising:

a conductor connected to the first wiring;

wherein

the first resin layer includes a third opening part, and

the conductor contacts the first wiring via the third opening part.

8. The semiconductor device according to claim 7 , further comprising:

a FPC connected to the first wiring via the conductor at an opposite side of the first wiring with respect to the first resin layer.

9. The semiconductor device according to claim 7 , wherein the first wiring includes a transparent conductive film.

10. The semiconductor device according to claim 7 , wherein the first wiring is a stacked layer structure including a metal film and a transparent conductive film, and the transparent conductive film is closer to the first resin layer than the metal film.