Method of manufacturing finger electrode for solar cell and finger electrode for solar cell manufactured thereby
A method of manufacturing a finger electrode for a solar cell includes printing a conductive paste on a front surface of a substrate using a printing mask having an opening rate of 65% or more, and baking the printed conductive paste. The conductive paste may include a conductive powder, a glass frit, and an organic vehicle, and the conductive powder may include a first conductive powder having a particle diameter (D50) of about 0.1 μm to about 1.5 μm and a second conductive powder having a particle diameter (D50) of greater than 1.5 μm to about 5 μm, and the conductive powder as a whole has a particle diameter (D10) of about 0.5 μm or less.
1. A method of manufacturing a finger electrode for a solar cell, the method comprising:
printing a conductive paste on a front surface of a substrate using a printing mask having an opening rate of 65% or more; and
baking the printed conductive paste,
wherein the conductive paste includes a conductive powder, a glass frit, and an organic vehicle, and
wherein the conductive powder includes a first conductive powder having a particle diameter (D50) of about 0.1 μm to about 1.5 μm and a second conductive powder having a particle diameter (D50) of greater than 1.5 μm to about 5 μm, and the conductive powder as a whole has a particle diameter (D10) of about 0.5 μm or less.
2. The method as claimed in claim 1 , wherein the conductive powder as a whole has a particle diameter (D10) of about 0.1 μm to about 0.2 μm.
3. The method as claimed in claim 1 , wherein a weight ratio of the first conductive powder to the second conductive powder ranges from about 1:99 to about 99:1.
4. The method as claimed in claim 1 , wherein the printing mask has an opening rate of about 65% to about 90%.
5. The method as claimed in claim 1 , wherein the printing mask includes a mesh, a photosensitive resin layer integrated with the mesh, and an electrode printing portion formed by removing the photosensitive resin layer.
6. The method as claimed in claim 1 , wherein baking of the conductive paste is performed at about 600° C. to about 1,000° C.
7. The method as claimed in claim 1 , wherein the glass frit includes at least one of lead (Pb), bismuth (Bi), tellurium (Te), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), lithium (Li), boron (B), silicon (Si), zinc (Zn), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), sodium (Na), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), and aluminum (Al) oxides.
8. The method as claimed in claim 1 , wherein the conductive paste includes about 60 wt % to about 95 wt % of the conductive powder, about 0.5 wt % to about 20 wt % of the glass frit, and about 1 wt % to about 30 wt % of the organic vehicle.
9. The method as claimed in claim 1 , wherein the conductive paste further includes: at least one additive of a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an anti-foaming agent, a pigment, a UV stabilizer, an antioxidant, and a coupling agent.
10. A finger electrode for a solar cell manufactured by the method as claimed in claim 1 .
11. A solar cell comprising a finger electrode manufactured by the method as claimed in claim 1 .
12. The method as claimed in claim 1 , wherein:
the first conductive powder is silver, aluminum, nickel, copper, or a combination thereof, and
the second conductive powder is silver, aluminum, nickel, copper, or a combination thereof.
13. The method as claimed in claim 1 , wherein the first conductive powder and the second conductive powder are a same metal.