Positioning substrates in imprint lithography processes
An imprint lithography method for positioning substrates includes supporting first and second substrates respectively atop first and second chucks, pneumatically suspending the first and second chucks laterally within first and second bushings, supporting the first and second chucks vertically within the first and second bushings, maintaining the first and second chucks respectively in first and second fixed rotational orientations, and forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations.
1. An imprint lithography method for positioning substrates, the imprint lithography method comprising:
supporting first and second substrates respectively atop first and second chucks;
pneumatically suspending the first and second chucks laterally within first and second bushings, respectively, wherein pneumatically suspending the first and second chucks laterally within first and second bushings comprises applying radial air pressure to the first and second chucks;
supporting the first and second chucks vertically within the first and second bushings, respectively;
maintaining the first and second chucks respectively in first and second fixed rotational orientations;
forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations; and
after the first and second top surfaces of the first and second substrates are coplanar, acting upon the first and second substrates with a template.
2. The imprint lithography method of claim 1 , wherein a first thickness of the first substrate is different from a second thickness of the second substrate.
3. The imprint lithography method of claim 1 , further comprising respectively suctioning the first and second substrates to the first and second chucks.
4. The imprint lithography method of claim 3 , further comprising independently controlling a suction pressure applied to the first substrate and a suction pressure applied to the second substrate.
5. The imprint lithography method of claim 1 , wherein the first and second vertical resistive forces are provided by a vertical air pressure.
6. The imprint lithography method of claim 5 , further comprising controlling the vertical air pressure within an air plenum that is in fluid contact with the first and second chucks.
7. The imprint lithography method of claim 5 , wherein the first and second vertical resistive forces are respectively provided by air delivered by first and second air cylinders.
8. The imprint lithography method of claim 1 , wherein the first and second vertical resistive forces are provided by a spring.
9. The imprint lithography method of claim 1 , wherein the first and second fixed rotational orientations of the first and second chucks are maintained by first and second strips that connect the first and second chucks to a base supporting the first and second bushings.
10. The imprint lithography method of claim 1 , wherein the first and second fixed rotational orientations of the first and second chucks are maintained by first and second double-shaft arrangements respectively associated with the first and second bushings.
11. The imprint lithography method of claim 1 , further comprising applying an upwardly directed force to a substrate processing element.
12. The imprint lithography method of claim 1 , wherein applying the radial air pressure comprises directing air radially inward of the first and second bushings.
13. The imprint lithography method of claim 12 , wherein directing air radially inward of the first and second bushings comprises directing air through first and second pores respectively.
14. The imprint lithography method of claim 13 , wherein the first and second pores are arranged across first and second internal surfaces of the first and second bushings, respectively.
15. The imprint lithography method of claim 1 , further comprising abutting first and second end portions of the first and second chucks against a fixed structure to limit an upward vertical movement of the first and second chucks within the first and second bushings.
16. An imprint lithography method for positioning substrates, the imprint lithography method comprising:
supporting first and second substrates respectively atop first and second chucks;
pneumatically suspending the first and second chucks laterally within first and second bushings, respectively;
supporting the first and second chucks vertically within the first and second bushings, respectively;
abutting first and second end portions of the first and second chucks against a fixed structure to limit an upward vertical movement of the first and second chucks within the first and second bushings;
maintaining the first and second chucks respectively in first and second fixed rotational orientations;
forcing the first and second chucks in a downward direction independently of each other respectively against first and second vertical resistive forces until first and second top surfaces of the first and second substrates are coplanar, while maintaining the first and second chucks suspended laterally within the first and second bushings and while maintaining the first and second chucks in the first and second fixed rotational orientations; and
after the first and second top surfaces of the first and second substrates are coplanar, acting upon the first and second substrates with a template.